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Tra-Con Tra-Bond Ablebond 862-2 Room Temperature Cure Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond Ablebond 862-2 Room Temperature Cure Epoxy Adhesive.pdf
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Material Notes:
Ablebond 862-2 room temperature curing epoxy adhesive is designed for solder pad encapsulation or sealing the head/disk area in floppy disc assemblies. This resilient compound is suitable for bonding materials with mismatched coefficients of thermal expansion.Information provided by Tra-Con Inc.
Mechanical Properties Metric English Comments
Hardness, Shore D 60
60
Adhesive Bond Strength 13.8 MPa
2000 psi
Lap shear, alum to alum
Thermal Properties Metric English Comments
CTE, linear 75.0 µm/m-°C
41.7 µin/in-°F
Below Tg
200 µm/m-°C
111 µin/in-°F
Above Tg
Electrical Properties Metric English Comments
Volume Resistivity 3.00e+12 ohm-cm
3.00e+12 ohm-cm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 95.0 °C
1.00 hour

@Temperature 203 °F
120 min

@Temperature 65.0 °C
2.00 hour

@Temperature 149 °F
4320 min

@Temperature 25.0 °C
72.0 hour

@Temperature 77.0 °F
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
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