| Category | Polymer , Thermoset , Epoxy , Epoxy, Encapsulating, Glass or Mineral Filled , Filled/Reinforced Thermoset |
| Manufacturer | Sumitomo Bakelite North America |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Sumitomo Bakelite North America 4064 Mineral Filled Electrical Encapsulation Grade Epoxy.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.79 g/cc | 0.0647 lb/in³ | ASTM D792 |
| Water Absorption | 0.10 % | 0.10 % | 48 hours, 50°C. ASTM D570 |
| Linear Mold Shrinkage | 0.0040 - 0.0070 cm/cm | 0.0040 - 0.0070 in/in | Compression Molding. ASTM D955 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Barcol | 70 | 70 | |
| Tensile Strength, Ultimate | 41.0 MPa | 5950 psi | ASTM D638 |
| Flexural Yield Strength | 131 MPa | 19000 psi | ASTM D790 |
| Flexural Modulus | 19.0 GPa | 2760 ksi | ASTM D790 |
| Compressive Yield Strength | 262 MPa | 38000 psi | ASTM D695 |
| Izod Impact, Notched | 0.270 J/cm | 0.506 ft-lb/in | ASTM D256A |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear, Parallel to Flow | 20.0 µm/m-°C @Temperature 20.0 °C |
11.1 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 3.5 | 3.5 | Wet; ASTM D150 |
| Dielectric Strength | 13.0 kV/mm | 330 kV/in | Wet, short term. ASTM D149 |
| Dissipation Factor | 0.019 @Frequency 1e+6 Hz |
0.019 @Frequency 1e+6 Hz |
Wet; ASTM D150 |
| Arc Resistance | 180 sec | 180 sec | ASTM D495 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 143 - 177 °C | 289 - 351 °F | compression/transfer molding. |
| 174 - 182 °C | 345 - 360 °F | injection molding. |