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Rogers Corporation RO4350B Glass-Reinforced Hydrocarbon and Ceramic Laminate with Thin Film Resistor Foil

Category Ceramic , Ceramic Matrix Composite
Manufacturer Rogers Corporation
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Rogers Corporation RO4350B Glass-Reinforced Hydrocarbon and Ceramic Laminate with Thin Film Resistor Foil.pdf
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Material Notes:
RO4000® Series High Frequency Circuit Materials are glass-reinforced hydrocarbon and ceramic (not PTFE) laminates with TICER™ TCR® Thin Film Resistor Foils. These laminates are designed for performance sensitive, high volume commercial applications. RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR4) processes.Features and Benefits:Glass-reinforced hydrocarbon and ceramic dielectricVolume manufacturing processExcellent high-frequency performanceLow Z-axis expansion, excellent dimensional stabilityIntegrated thin film resistor benefitsFoils available in 25, 50 and 100 OPS NiCrFoils offered in 1/2 ounce copper weightLead-Free process compatibleTypical Applications:Global communications systemsHigh reliability and complex multilayer circuitsWireless communication devicesInformation provided by Rogers Corporation.
Physical Properties Metric English Comments
Density 1.86 g/cc
0.0672 lb/in³
ASTM D792
Moisture Absorption at Equilibrium 0.060 %

@Temperature 50.0 °C,
Time 173000 sec
0.060 %

@Temperature 122 °F,
Time 48.0 hour
Immersion; 0.06 in thick; ASTM D570
Thickness 168 - 1520 microns
6.60 - 60.0 mil
Range of Thicknesses Available
Mechanical Properties Metric English Comments
Tensile Strength 175 MPa
25400 psi
RT, Y direction; ASTM D638
Tensile Modulus 11.47 GPa
1664 ksi
RT, Y direction; ASTM D638
Flexural Strength 255 MPa
37000 psi
IPC-TM-650, 2.4.4
Peel Strength 0.877 kN/m
5.00 pli
Copper, After Solder Float, 1/2 ounce TCR Foil; IPC-TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 14.0 µm/m-°C

@Temperature -55.0 - 288 °C
7.78 µin/in-°F

@Temperature -67.0 - 550 °F
X-Direction; IPC-TM-650 2.4.41
16.0 µm/m-°C

@Temperature -55.0 - 288 °C
8.89 µin/in-°F

@Temperature -67.0 - 550 °F
Y-Direction; IPC-TM-650 2.4.41
35.0 µm/m-°C

@Temperature -55.0 - 288 °C
19.4 µin/in-°F

@Temperature -67.0 - 550 °F
Z-Direction; IPC-TM-650 2.4.41
Thermal Conductivity 0.690 W/m-K

@Temperature 80.0 °C
4.79 BTU-in/hr-ft²-°F

@Temperature 176 °F
ASTM C518
Glass Transition Temp, Tg >= 280 °C
>= 536 °F
Condition A; IPC-TM-650 2.4.24
Decomposition Temperature 390 °C
734 °F
TGA; ASTM D3850
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.20e+16 ohm-cm
1.20e+16 ohm-cm
Cond. A; IPC 2.5.17.1
Surface Resistance 5.70e+15 ohm
5.70e+15 ohm
Cond. A; IPC 2.5.17.1
Dielectric Constant 3.66
3.66
Design Spec., FSR, Z-direction; IPC-TM-650 2.5.5.6
3.43 - 3.53

@Frequency 1.00e+10 Hz
3.43 - 3.53

@Frequency 1.00e+10 Hz
Process, Clamped stripline, Z-direction; IPC-TM-650 2.5.5.5
Dielectric Strength 30.7 kV/mm

@Thickness 0.510 mm
780 kV/in

@Thickness 0.0201 in
Z Direction; IPC-TM-650 2.5.6.2
Dissipation Factor 0.0031

@Frequency 2.50e+9 Hz
0.0031

@Frequency 2.50e+9 Hz
IPC-TM-650 2.5.5.5
0.0037

@Frequency 1.00e+10 Hz
0.0037

@Frequency 1.00e+10 Hz
IPC-TM-650 2.5.5.5
Descriptive Properties Value Comments
Dimensional Stability < 0.5 mm/m
X, Y direction; IPC-TM-650, 2.4.39A; after etch; +E2/150°C
Thermal Coefficient of Dielectric Constant 50 ppm/°C
IPC-TM-650 2.5.5.5; -50°C to 150°C; Z-Direction
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