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Rogers Corporation RO3035 Ceramic-Filled PTFE Composite, High Frequency Circuit Material

Category Polymer , Thermoplastic , Fluoropolymer , PTFE , Polytetrafluoroethylene (PTFE), Glass Filled, Molded
Manufacturer Rogers Corporation
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Rogers Corporation RO3035 Ceramic-Filled PTFE Composite, High Frequency Circuit Material.pdf
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Material Notes:
Features and Benefits:Low dielectric lossExcellent mechanical properties versus temperature - reliable stripline and multi-layer board constructions.Uniform mechanical properties- ideal for multi-layer board designs with a range of dielectric constants and suitable for use with epoxy glass multi-layer board hybrid designs.Low in-plane expansion coefficient (match to copper) - allows for more reliable surface mounted assemblies, ideal for applications sensitive to temperature change and excellent dimensional stabilityStable dielectric constant versus temperature and frequency - Ideal for band pass filters, microstrip patch antennas and voltage controlled oscillatorsHigh thermal conductivity - Lower operating temperature and increased reliability in power amplifier applicationsLead-free process compatibleUses:Commercial microwave applicationsRF applicationsInformation provided by Rogers Corporation.
Physical Properties Metric English Comments
Density 2.10 g/cc
0.0759 lb/in³
Water Absorption <= 0.10 %
<= 0.10 %
D24/23; IPC-TM-650 2.6.2.1
Thickness 127 - 1520 microns
5.00 - 60.0 mil
Range of Thicknesses Available
Mechanical Properties Metric English Comments
Peel Strength 1.79 kN/m

@Temperature 288 °C,
Time 10.0 sec
10.2 pli

@Temperature 550 °F,
Time 0.00278 hour
Copper, After Solder Float; IPC-TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 17.0 µm/m-°C

@Temperature -55.0 - 288 °C
9.44 µin/in-°F

@Temperature -67.0 - 550 °F
X, Y- Direction; IPC-TM-650 2.4.41
24.0 µm/m-°C

@Temperature -55.0 - 288 °C
13.3 µin/in-°F

@Temperature -67.0 - 550 °F
Z-Direction; IPC-TM-650 2.4.41
Specific Heat Capacity 0.930 J/g-°C
0.222 BTU/lb-°F
Calculated
Thermal Conductivity 0.500 W/m-K

@Temperature 80.0 °C
3.47 BTU-in/hr-ft²-°F

@Temperature 176 °F
ASTM C518
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
Cond. A; IPC 2.5.17.1
Surface Resistance 1.00e+13 ohm
1.00e+13 ohm
Cond. A; IPC 2.5.17.1
Dielectric Constant 3.45 - 3.55

@Frequency 1.00e+10 Hz
3.45 - 3.55

@Frequency 1.00e+10 Hz
Process, Clamped Stripline; IPC-TM-650 2.5.5.5
3.6

@Frequency 8.00e+9 - 4.00e+10 Hz
3.6

@Frequency 8.00e+9 - 4.00e+10 Hz
Design; Differential Phase Length Method
Dissipation Factor 0.0017

@Frequency 1.00e+10 Hz
0.0017

@Frequency 1.00e+10 Hz
IPC-TM-650 2.5.5.5
Descriptive Properties Value Comments
Thermal Coefficient of Dielectric Constant -11 ppm/°C
IPC-TM-650 2.5.5.5; 10°C to 150°C; Z-Direction
-34 ppm/°C
IPC-TM-650 2.5.5.5; -50°C to 10°C; Z-Direction
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