Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System

Category	Polymer , Adhesive
Manufacturer	Rogers Corporation
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Low dielectric constant and loss tangentIdeal for multi-layer bondingCompatible with traditional processing methodsCompatible with a broad range of material types including PTFE compositesReliable through sequential bondingCan be tack bonded to inner-layer surfaces prior to machining cut-outsExcellent blind via fill capabilityPredictable control of post-bond thicknessLead-Free process compatibleColor: WhiteTypical Applications:Automotive Radar and SensorsPoint-to point MicrowaveBase Station AntennasPower AmplifiersPhased Array RadarRF ComponentsPatch AntennasPower BackplanesInformation provided by Rogers Corporation.

Physical Properties	Metric	English	Comments
Specific Gravity	1.50 g/cc	1.50 g/cc	ASTM D792
Moisture Absorption at Equilibrium	0.10 %	0.10 %	D24/23; ASTM D570
Outgassing - Total Mass Loss	0.020 %	0.020 %	CVCM; ASTM E595
	0.030 %	0.030 %	WVR; ASTM E595
	0.42 %	0.42 %	TML; ASTM E595

Mechanical Properties	Metric	English	Comments
Peel Strength	0.877 kN/m	5.00 pli	Copper; X- and Y-Directions; 1/2 oz. EDC Post Solder; IPC-TM-650 2.4.8

Thermal Properties	Metric	English	Comments
CTE, linear	50.0 µm/m-°C @Temperature 0.000 - 150 °C	27.8 µin/in-°F @Temperature 32.0 - 302 °F	X-Direction; IPC-TM-650 2.4.41
	50.0 µm/m-°C @Temperature 0.000 - 150 °C	27.8 µin/in-°F @Temperature 32.0 - 302 °F	Y-Direction; IPC-TM-650 2.4.41
	50.0 µm/m-°C @Temperature 0.000 - 150 °C	27.8 µin/in-°F @Temperature 32.0 - 302 °F	Z-Direction; IPC-TM-650 2.4.41
Thermal Conductivity	0.400 W/m-K @Temperature 80.0 °C	2.78 BTU-in/hr-ft²-°F @Temperature 176 °F	Z Direction; ASTM C518
Glass Transition Temp, Tg	170 °C	338 °F	DMA Method; IPC-TM-650 2.4.24
Decomposition Temperature	400 °C	752 °F	TGA 5% WT; ASTM D3850

Electrical Properties	Metric	English	Comments
Dielectric Constant	2.89 - 2.99 @Frequency 1.00e+10 Hz	2.89 - 2.99 @Frequency 1.00e+10 Hz	Z Direction; IPC-TM-650 2.5.5.5.1
Dielectric Strength	98.4 kV/mm	2500 kV/in	Z Direction, 50% RH; IPC-TM-650 2.5.6.2
Dissipation Factor	0.0030	0.0030	IPC-TM-650 2.5.5.5

Descriptive Properties	Value	Comments
Thermal Coefficient of Dielectric Constant	-6 ppm/°C	IPC-TM-650 2.5.5.5; -50°C to 150°C; Z-Direction
Time to Delamination (T-288)	> 30 min	TMA, Z-direction

Users viewing this material also viewed the following: