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Resin Technology Group EN 139-2 UV Gellable, Low Temperature Cure, One-Component Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Resin Technology Group
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resin Technology Group EN 139-2 UV Gellable, Low Temperature Cure, One-Component Epoxy Adhesive.pdf
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Material Notes:
EN 139-2 is a UV gellable, one-component epoxy based adhesive system designed to provide cure at temperatures as low as 80°C. This one-part adhesive gels to a tack-free, low strength polymer upon exposure to mid-range UV light. Complete cure can be realized at elevated temperatures and develops tough, strong bonds to a wide variety of materials, including metals, glass, ceramics and plastics. The cured material has high strength and good dimensional stability.Applications: Disk drive engineering products, Non-acrylic UV bonding. No outgassing concerns. Electronic-Opto, Fillet-tacking and staking.Processing: UV light cure: Intensity of 200 mw/cm2; Spectral output of 300 to 500 nanometers; Optimum wavelength of 375 nanometersRecommended Aurora UV light sources:Aurora 455-S 5x5 High Intensity FloodAurora 461-S 1x6 High Intensity BeamAurora 100-S Spot Light GuideInformation provided by Resin Technology Group.
Physical Properties Metric English Comments
Viscosity 10000 cP

@Temperature 25.0 °C
10000 cP

@Temperature 77.0 °F
Uncured
Mechanical Properties Metric English Comments
Shear Strength 15.9 MPa
2300 psi
Cured, tensile, Al/Al
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 130 °C
266 °F
Cured
Minimum Service Temperature, Air -50.0 °C
-58.0 °F
Cured
Flash Point >= 93.3 °C
>= 200 °F
Uncured
Electrical Properties Metric English Comments
Dielectric Strength >= 15.7 kV/mm
>= 400 kV/in
Cured
Descriptive Properties Value Comments
Color Natural
Composition Epoxy
Moisture Resistance Excellent
Cured
Toxicity Low
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