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Reltek BONDiT™ HM-505 Coating, Sealant, Adhesive System
| Category | Polymer , Adhesive |
| Manufacturer | Reltek LLC |
| Trade Name | BONDiT™ |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Reltek BONDiT™ HM-505 Coating, Sealant, Adhesive System.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Information provided by Reltek LLC
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 0.955 g/cc | 0.0345 lb/in³ | |
| Moisture Absorption at Equilibrium | 0.040 % @Temperature 40.0 °C |
0.040 % @Temperature 104 °F |
100% RH |
| Water Vapor Transmission | <= 35.7 g/m²/day @Temperature 38.0 °C |
<= 2.30 g/100 in²/day @Temperature 100 °F |
ASTM E-96 |
| Oxygen Transmission | 138 cc-mm/m²-24hr-atm @Temperature 23.0 °C |
350 cc-mil/100 in²-24hr-atm @Temperature 73.4 °F |
ASTM D1434 |
| Viscosity | 850 cP | 850 cP | |
| Environmental Stress Crack Resistance | >= 200 hour | >= 200 hour |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 42 | 42 | ASTM D2240 |
| Tensile Strength at Break | 6.21 MPa | 900 psi | ASTM D638 |
| Elongation at Break | 350 % | 350 % | ASTM D638 |
| 2% Secant Modulus | 0.0221 GPa | 3.20 ksi | ASTM D790 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Crystallization Temperature | 75.0 °C | 167 °F | |
| Brittleness Temperature | -23.0 °C | -9.40 °F | ASTM D746 |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Approximate reverse impact | 24 | |
| Color | Clear | |
| Fungi Resistance | No Growth | |
| Insulation Resistance (V/mil) | 500 | |
| Thermal Shock | No effect |
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