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Reltek BONDiT™ B-521 Adhesive, Sealant & Potting System
| Category | Polymer , Adhesive , Thermoset |
| Manufacturer | Reltek LLC |
| Trade Name | BONDiT™ |
| Port | Shanghai port,China |
| Trade Terms | EXW, FOB, CFR, CIF |
| Payment Terms | L/C, T/T, PayPal |
| Download PDF | Reltek BONDiT™ B-521 Adhesive, Sealant & Potting System.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Key Properties: Outstanding for bonding dissimilar materials with high thermal expansion differential applications.Fast thermal cure, long pot life.Ease of use.Applications: Excellent for fast assembly of dissimilar materials with large differentials in thermal expansion, such as glass to acrylic. Bonds most plastics, metals, glass, and ceramics. Cure 10 minutes at 170°F.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 2500 cP | 2500 cP | Thrixotropic |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Slight haze |
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