Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Material

Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.Product Attributes: Superior thermal performance while maintaining low modulus and flows into complex geometries to maintain intimate contact with componentInformation provided by Chomerics