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Parker Chomerics CHO-FORM 5531 EMI Shielding Material

Category Polymer , Thermoset , Rubber or Thermoset Elastomer (TSE) , Silicone
Manufacturer Parker Chomerics
Trade Name CHO-FORM
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-FORM 5531 EMI Shielding Material.pdf
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Material Notes:
One component, moisture cure, form-in-place EMI gasketing material. This electrically conductive formulation contains silver-plated copper particles dispersed in a silicone elastomer. It is designed to be robotically dispensed using high pressure dispense equipment.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 3.20 g/cc
3.20 g/cc
ASTM D792
Deformation 10 %
10 %
4 N/cm
20 %
20 %
8 N/cm
30 %
30 %
15 N/cm
40 %
40 %
28 N/cm
50 %
50 %
52 N/cm
Mechanical Properties Metric English Comments
Hardness, Shore A 35
35
ASTM D2240
Tensile Strength at Break >= 0.517 MPa
>= 75.0 psi
ASTM D412
Compression Set 40 %
40 %
ASTM D395 Method B 22 hrs 85°C
40 %

@Temperature 85.0 °C,
Time 79200 sec
40 %

@Temperature 185 °F,
Time 22.0 hour
ASTM D395 Method B
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 85.0 °C
185 °F
Electrical Properties Metric English Comments
Volume Resistivity 0.0030 ohm-cm
0.0030 ohm-cm
Initial; Chomerics MAT-1002
0.0040 ohm-cm
0.0040 ohm-cm
Aged; Chomerics MAT-1002
Shielding Effectiveness 52 dB

@Frequency 1.00e+10 Hz
52 dB

@Frequency 1.00e+10 Hz
CHO-TP08
55 dB

@Frequency 2.00e+9 Hz
55 dB

@Frequency 2.00e+9 Hz
CHO-TP08
65 dB

@Frequency 6.00e+9 Hz
65 dB

@Frequency 6.00e+9 Hz
CHO-TP08
67 dB

@Frequency 1.00e+9 Hz
67 dB

@Frequency 1.00e+9 Hz
CHO-TP08
71 dB

@Frequency 2.00e+8 Hz
71 dB

@Frequency 2.00e+8 Hz
CHO-TP08
Processing Properties Metric English Comments
Extrusion Rate 5.50 g/min
5.50 g/min
Cure Time 18.0 min

@Temperature 22.0 °C
0.300 hour

@Temperature 71.6 °F
50% RH; Tack Free Time
240 min

@Temperature 22.0 °C
4.00 hour

@Temperature 71.6 °F
50% RH; Handling Time
2880 min

@Temperature 22.0 °C
48.0 hour

@Temperature 71.6 °F
50% RH; Full Cure
Descriptive Properties Value Comments
Cure Mechanism Moisture
Filler Ag/Cu
Resin One Part Silicone
Time for QC Measurements 8 hrs
Electrical Resistance and Adhesion @ 22°C 50% RH
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