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Parker Chomerics CHO-BOND 1030 Conductive Silicone Gasket Adhesive

Category Polymer , Adhesive , Thermoset , Silicone
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND 1030 Conductive Silicone Gasket Adhesive.pdf
Price EMAIL US    sales@lookpolymers.com
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Material Notes:
Electrically conductive one-component silicone-based RTV adhesive which greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. This adhesive cures on exposure to moisture in air, contains no acetic acid or other corrosive curing agents, and is workable for up to 30 minutes after exposure to moist air.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 3.50 - 4.00 g/cc
3.50 - 4.00 g/cc
Volatile Organic Compounds (VOC) Content 151 g/l
151 g/l
Thickness 30.0 microns
1.18 mil
Recommended
Mechanical Properties Metric English Comments
Shear Strength >= 1.38 MPa
>= 200 psi
Lap
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 200 °C
392 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.050 ohm-cm
<= 0.050 ohm-cm
DC
Processing Properties Metric English Comments
Cure Time 10100 min

@Temperature 23.0 °C
168 hour

@Temperature 73.4 °F
Shelf Life 6.00 Month
6.00 Month
Descriptive Properties Value Comments
Binder Silicone
Consistency Gritty paste
Coverage 18.5 cm2 / g
Filler Ag/Cu
Mix Ratio 1-part
Working Life 0.5 hrs
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