Parker Chomerics CHO-BOND 1030 Conductive Silicone Gasket Adhesive

Category	Polymer , Adhesive , Thermoset , Silicone
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND 1030 Conductive Silicone Gasket Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Electrically conductive one-component silicone-based RTV adhesive which greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. This adhesive cures on exposure to moisture in air, contains no acetic acid or other corrosive curing agents, and is workable for up to 30 minutes after exposure to moist air.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	3.50 - 4.00 g/cc	3.50 - 4.00 g/cc
Volatile Organic Compounds (VOC) Content	151 g/l	151 g/l
Thickness	30.0 microns	1.18 mil	Recommended

Mechanical Properties	Metric	English	Comments
Shear Strength	>= 1.38 MPa	>= 200 psi	Lap

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	200 °C	392 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.050 ohm-cm	<= 0.050 ohm-cm	DC

Processing Properties	Metric	English	Comments
Cure Time	10100 min @Temperature 23.0 °C	168 hour @Temperature 73.4 °F
Shelf Life	6.00 Month	6.00 Month

Descriptive Properties	Value	Comments
Binder	Silicone
Consistency	Gritty paste
Coverage	18.5 cm² / g
Filler	Ag/Cu
Mix Ratio	1-part
Working Life	0.5 hrs

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