Category | Polymer , Adhesive , Thermoset , Silicone |
Manufacturer | Parker Chomerics |
Trade Name | CHO-BOND |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Parker Chomerics CHO-BOND 1030 Conductive Silicone Gasket Adhesive.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Specific Gravity | 3.50 - 4.00 g/cc | 3.50 - 4.00 g/cc | |
Volatile Organic Compounds (VOC) Content | 151 g/l | 151 g/l | |
Thickness | 30.0 microns | 1.18 mil | Recommended |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Shear Strength | >= 1.38 MPa | >= 200 psi | Lap |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
Maximum Service Temperature, Air | 200 °C | 392 °F | |
Minimum Service Temperature, Air | -55.0 °C | -67.0 °F |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | <= 0.050 ohm-cm | <= 0.050 ohm-cm | DC |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Cure Time | 10100 min @Temperature 23.0 °C |
168 hour @Temperature 73.4 °F |
|
Shelf Life | 6.00 Month | 6.00 Month |
Descriptive Properties | Value | Comments |
---|---|---|
Binder | Silicone | |
Consistency | Gritty paste | |
Coverage | 18.5 cm2 / g | |
Filler | Ag/Cu | |
Mix Ratio | 1-part | |
Working Life | 0.5 hrs |