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Parker Chomerics CHO-BOND® 1016 Electrically Conductive Sealant

Category Other Engineering Material , Polymer , Thermoset , Silicone
Manufacturer Parker Chomerics
Trade Name CHO-BOND®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND® 1016 Electrically Conductive Sealant.pdf
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Material Notes:
Description: CHO-BOND 1016 sealant is an electrically conductive, one-component RTV silicone which provides both environmental sealing and EMI shielding. This seal, filled with nickel-plated graphite particles, contains no acetic acid, and cures in the presence of moisture at room temperature. Skin formation takes only a few minutes and full property development takes one week. CHO-BOND 1016 sealant is ideal for outdoor enclosure applications where both EMI shielding and galvanic corrosion are requirements. This product should be stored at or below 77°F (25°C)Features: Excellent resistance to galvanic corrosion, Non-corrosive sealant, Cures in the presence of moisture, Needs no pressure during cure (excellent as a fillet seal), Rapid skin formation.Application: If CHO-BOND 1016 sealant is being applied to a non-silicone surface, a very thin coating of CHO-BOND 1086 primer must first be applied with a clean cloth. Before applying CHO-BOND 1016 sealant, primer must be allowed to dry 15-30 minutes. (Note: Primer is included in CHO-BOND 1016 sealant package).Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 1.95 - 2.45 g/cc
1.95 - 2.45 g/cc
ASTM D792
Thickness 180 - 1020 microns
7.09 - 40.2 mil
Mechanical Properties Metric English Comments
Hardness, Shore A 80
80
ASTM D2240
Shear Strength >= 1.04 MPa
>= 151 psi
Lap; ASTM D1002
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -45.0 °C
-49.0 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.95 ohm-cm
<= 0.95 ohm-cm
DC; ASTM D2739
Shielding Effectiveness <= 50 dB
<= 50 dB
CH-TP08
Processing Properties Metric English Comments
Cure Time 10100 min

@Temperature 25.0 °C
168 hour

@Temperature 77.0 °F
Shelf Life 9.00 Month
9.00 Month
Descriptive Properties Value Comments
Binder Silicone
Consistency Medium Paste
Corrosion Resistance 15 mg
weight loss, CHO-TM 100
Coverage 18.1 cm2/g
0.0254mm thickness
Filler Nickel-plated graphite (Ni/c)
Mix Ratio 1-part
by weight
Work Life 0.5 hr.
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