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- Park Electrochemical Nelcote® F-557 Phenolic Prepreg, Chopped Molding Compound Reinforced
Park Electrochemical Nelcote® F-557 Phenolic Prepreg, Chopped Molding Compound Reinforced
| Category | Polymer , Thermoset , Phenolic |
| Manufacturer | Park Electrochemical Corp. |
| Trade Name | Nelcote® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Park Electrochemical Nelcote® F-557 Phenolic Prepreg, Chopped Molding Compound Reinforced.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Nelcote® F-557 is a high purity silica filler phonic resin coated on Commercial or Aerospace grade silica fabric. F-557 is used in the manufacture of intermediate temperature ablative rocket nozzles, heat shields, and combustion chambers in highly oxidative environments.Key Features and Benefits:Provides a combination of high-strength and ablative properties for demanding applicationsLow thermal expansionGood Tack and Drape propertiesApplications/Qualifications:Rocket NozzlesCombustion ChambersHeat ShieldsRocket Motor Throat SectionsInformation provided by Park Electrochemical Corp.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Volatiles | 2.0 - 5.0 % @Temperature 135 °C |
2.0 - 5.0 % @Temperature 275 °F |
8 min |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength, Yield | 29.6 MPa @Temperature 23.9 °C |
4300 psi @Temperature 75.0 °F |
0° Direction, Dry; 325°F 2500psi; ASTM D3039b |
| 37.2 MPa @Temperature 23.9 °C |
5400 psi @Temperature 75.0 °F |
0° Direction, Dry; 325°F 2500psi and Post-Cure; ASTM D3039b | |
| Tensile Modulus | 15.2 GPa @Temperature 23.9 °C |
2200 ksi @Temperature 75.0 °F |
0° Direction, Dry; 325°F 2500psi and Post-Cure; ASTM D3039b |
| 17.2 GPa @Temperature 23.9 °C |
2500 ksi @Temperature 75.0 °F |
0° Direction, Dry; 325°F 2500psi; ASTM D3039b | |
| Flexural Strength | 58.6 MPa @Temperature 23.9 °C |
8500 psi @Temperature 75.0 °F |
Dry; 325°F 2500psi; ASTM D790 |
| 103 MPa @Temperature 23.9 °C |
15000 psi @Temperature 75.0 °F |
Dry; 325°F 2500psi and Post-Cure; ASTM D790 | |
| Flexural Modulus | 14.5 GPa @Temperature 23.9 °C |
2100 ksi @Temperature 75.0 °F |
Dry; 325°F 2500psi and Post-Cure; ASTM D790 |
| Compressive Strength | 176 MPa @Temperature 23.9 °C |
25500 psi @Temperature 75.0 °F |
Dry; 325°F 2500psi; ASTM D695 |
| 214 MPa @Temperature 23.9 °C |
31000 psi @Temperature 75.0 °F |
Dry; 325°F 2500psi and Post-Cure; ASTM D695 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Heat Capacity | 1.00 J/g-°C | 0.240 BTU/lb-°F | ASTM C351 |
| Thermal Conductivity | 0.389 W/m-K @Temperature 149 °C |
2.70 BTU-in/hr-ft²-°F @Temperature 300 °F |
ASTM C177 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Shelf Life | 6.00 Month @Temperature 4.44 °C |
6.00 Month @Temperature 40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Filler Content (%) | 3.4-5.4 | |
| Nominal Prepreg Weight (oz/yd) | 30 | |
| Resin Flow (%) | 10-25 | 325°F, 150psi |
| Resin Solids Content (%) | 30-36 |
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