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Park Electrochemical Nelco® N5000-30/32 BT Epoxy Package

Category Polymer , Thermoset , Epoxy
Manufacturer Park Electrochemical Corp.
Trade Name Nelco®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Park Electrochemical Nelco® N5000-30/32 BT Epoxy Package.pdf
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Material Notes:
The Nelco N5000-30 prepreg and N5000-32 laminate BT epoxy materials are designed specifically to meet or exceed new and emerging chippackaging requirements. The primary applications of these materials include high performance interconnects that form the circuitry inside plastic BGAs, PBGAs and LGAs.Key Features and Benefits:BT resin chemistryExcellent Reliability and PerformanceChip Packaging OptionsMeets JEDEC StandardsWide processing latitudeApplications/Qualifications:BGA MultilayersPBGALGPCMCIAMCM-LsDirect Chip AttachJEDEC Conforming PackagesRoHS CompliantMeets IPC-4101/30 SpecificationsInformation provided by Park Electrochemical Corp.
Physical Properties Metric English Comments
Water Absorption <= 0.050 %
<= 0.050 %
IPC-TM-650.2.6.2.1
Mechanical Properties Metric English Comments
Modulus of Elasticity 22.8 GPa
3300 ksi
Y; ASTM D3039
23.4 GPa
3400 ksi
X; ASTM D3039
Poissons Ratio 0.21
0.21
X; ASTM D3039
0.21
0.21
Y; ASTM D3039
Shear Modulus 9.42 - 9.67 GPa
1370 - 1400 ksi
Calculated
Peel Strength 1.53 kN/m
8.70 pli
at elevated temperature; IPC-TM-650.2.4.8.2a
1.61 kN/m
9.20 pli
after solder float; IPC-TM-650.2.4.8
Thermal Properties Metric English Comments
CTE, linear 14.0 µm/m-°C

@Temperature -40.0 - 125 °C
7.78 µin/in-°F

@Temperature -40.0 - 257 °F
IPC-TM-650.2.4.41
Glass Transition Temp, Tg 205 °C
401 °F
DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature 344 °C
651 °F
5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+15 ohm-cm
1.00e+15 ohm-cm
C - 96/35/90; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+14 ohm
1.00e+14 ohm
C - 96/35/90; IPC-TM-650.2.5.17.1
Dielectric Constant 4.1

@Frequency 1.00e+9 Hz
4.1

@Frequency 1.00e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
4.4

@Frequency 1.00e+6 Hz
4.4

@Frequency 1.00e+6 Hz
TFC/LCR Meter; IPC-TM-650.2.5.5.3
Dielectric Strength 68.9 kV/mm
1750 kV/in
IPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 V
>= 50000 V
IPC-TM-650.2.5.6
Dissipation Factor 0.0090

@Frequency 1.00e+6 Hz
0.0090

@Frequency 1.00e+6 Hz
TFC/LCR Meter; IPC-TM-650.2.5.5.3
Arc Resistance 145 sec
145 sec
IPC-TM-650.2.5.1
Descriptive Properties Value Comments
Pressure Cooker Pass
60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes) 12+
IPC-TM-650.2.4.24.1
Z Axis Expansion (%) 3.6
50ºC to 260ºC; IPC-TM-650.2.4.41
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