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Master Bond EP51 Fast Curing High Bond Strength Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP51 Fast Curing High Bond Strength Epoxy Adhesive.pdf
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Material Notes:
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature.
Physical Properties Metric English Comments
Viscosity 10000 - 12000 cP

@Temperature 23.0 °C
10000 - 12000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -269 °C
-453 °F
Processing Properties Metric English Comments
Cure Time 240 - 360 min

@Temperature 23.0 °C
4.00 - 6.00 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Clear; "B" Tan
Mix Ratio By Weight 100/100
Set-Up Time, minutes 5
At Room Temperature
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