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Master Bond EP29LP Low Exotherm, Low Viscosity Two Component Epoxy System

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP29LP Low Exotherm, Low Viscosity Two Component Epoxy System.pdf
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Material Notes:
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 3,500 psi (aluminum to aluminum). It bonds well to a variety of substrates including optical fibers and fibrous reinforcements such as glass, aramid, and graphite.
Physical Properties Metric English Comments
Viscosity 800 cP

@Temperature 23.0 °C
800 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Processing Properties Metric English Comments
Cure Time 240 - 360 min

@Temperature 93.3 °C
4.00 - 6.00 hour

@Temperature 200 °F
7200 - 10100 min

@Temperature 23.0 °C
120 - 168 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Clear; "B" Clear
Mix Ratio By Weight 100/50
Set-Up Time, minutes min 360
At Room Temperature
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