Master Bond EP112FLAN-1 Two Component Flexibilized Heat Curing Epoxy

Master Bond EP112FLAN-1 is a toughened two component, high performance epoxy resin system featuring good temperature resistance, high thermal conductivity, fine electrical insulation values and sound dimensional stability. The mix ratio is 100:80 by weight. After mixing EP112FLAN-1 has a very long open time of a few days but requires oven curing. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour post cure at 350°F, although, a number of variations are possible. Also EP112FLAN-1 is ideal for potting and encapsulation because of its lower viscosity and its advantageous flow properties. The epoxy bonds well to metals, composites, glass, ceramics and many plastics.