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Master Bond EP112 Low Viscosity Heat Curing Cycloaliphatic Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy Cure Resin
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP112 Low Viscosity Heat Curing Cycloaliphatic Epoxy Adhesive.pdf
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Material Notes:
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical & electronic structural applications. Additional desirable performance qualities are high thermal and dimensional stability, very good thermal shock and vibration resistance and excellent adhesion to metals and a variety of other substrates including glass fibers, ceramics and many plastics.
Physical Properties Metric English Comments
Viscosity 200 - 250 cP
200 - 250 cP
Mechanical Properties Metric English Comments
Hardness, Shore D 93
93
Tensile Strength 35.9 MPa

@Temperature 149 °C
5200 psi

@Temperature 300 °F
70.3 MPa

@Temperature 23.9 °C
10200 psi

@Temperature 75.0 °F
Elongation at Break 2.4 %

@Temperature 75.0 °C
2.4 %

@Temperature 167 °F
6.9 %

@Temperature 300 °C
6.9 %

@Temperature 572 °F
Tensile Modulus 1.57 GPa

@Temperature 149 °C
228 ksi

@Temperature 300 °F
3.07 GPa

@Temperature 23.9 °C
445 ksi

@Temperature 75.0 °F
Flexural Strength 112.0 MPa
16250 psi
Compressive Strength 154 MPa
22300 psi
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 260 °C
500 °F
Heat Distortion Temperature 193 °C
380 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Shrinkage 0.25 - 1.2 %
0.25 - 1.2 %
Cure shrinkage
Electrical Properties Metric English Comments
Volume Resistivity 1.80e+15 ohm-cm

@Temperature 300 °C
1.80e+15 ohm-cm

@Temperature 572 °F
1.50e+16 ohm-cm

@Temperature 75.0 °C
1.50e+16 ohm-cm

@Temperature 167 °F
Surface Resistance 2.80e+14 ohm
2.80e+14 ohm
5.00e+14 ohm
5.00e+14 ohm
Dielectric Constant 2.95

@Frequency 60.0 Hz,
Temperature 149 °C
2.95

@Frequency 60.0 Hz,
Temperature 300 °F
2.96

@Frequency 60.0 Hz,
Temperature 23.0 °C
2.96

@Frequency 60.0 Hz,
Temperature 73.4 °F
Dielectric Strength >= 17.3 kV/mm

@Thickness 3.17 mm
>= 440 kV/in

@Thickness 0.125 in
Dissipation Factor 0.0030

@Frequency 60.0 Hz,
Temperature 149 °C
0.0030

@Frequency 60.0 Hz,
Temperature 300 °F
0.0060

@Frequency 60.0 Hz,
Temperature 23.0 °C
0.0060

@Frequency 60.0 Hz,
Temperature 73.4 °F
Arc Resistance >= 150 sec
>= 150 sec
Dry; ASTM D495
Track Resistance >= 1.20e+6 sec
>= 1.20e+6 sec
Wet, 2.5 KV; ASTM D2303
Processing Properties Metric English Comments
Shelf Life 12.0 Month
12.0 Month
unopened containers
Descriptive Properties Value Comments
Weight Loss 0.0006
24 hrs at 350°F
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