Lord Adhesives Metech 3615 Platinum Gold Conductor Composition

Category	Polymer , Adhesive
Manufacturer	Lord Adhesives
Trade Name	Metech
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Lord Adhesives Metech 3615 Platinum Gold Conductor Composition.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Platinum gold conductor composition 3615 is a mixed bond conductor designed for military, aerospace, and other high reliability applications that require soldered connections. This composition is designed for use with Metech 3610 or 3612 gold composition and with Metech 7600A multilayer dielectric composition. Fired films exhibit high initial and aged adhesion, and can be soldered using either nonactivated or mildly activated fluxes.All information provided by Lord.

Physical Properties	Metric	English	Comments
Brookfield Viscosity	190000 - 240000 cP @Temperature 25.0 Â°C	190000 - 240000 cP @Temperature 77.0 Â°F	HBT, Spindle #SC4-14 @ 10rpm
Thickness	10.0 - 13.0 microns	0.394 - 0.512 mil	Fired

Electrical Properties	Metric	English	Comments
Surface Resistivity per Square	<= 0.080 ohm	<= 0.080 ohm

Processing Properties	Metric	English	Comments
Shelf Life	6.00 Month @Temperature 25.0 Â°C	6.00 Month @Temperature 77.0 Â°F

Descriptive Properties	Value	Comments
Adhesion	3.5-4	lbs; aged (500hrs. at 150ÂºC)
	4-5	lbs; initial
Coverage (cmÂ²/gm)	50-60	Calculated from 50 micron wet film; Fired at 850ÂºC with a 10-minute dwell time
Line Resolution (microns)	150
Solder Leach Resistance (cycles)	40	Number of 5-second cycles required to leach 50% of a 10 mil wide conductive line using 62Sn/37Pb at 240ÂºC
Solder Wetting (seconds)	< 5	Time required to 100% solder wet 0.08" x 0.08" pad size using 62Sn/37Pb at 240ÂºC

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