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Indium Corp. Indalloy® 158 Bi-Pb-Sn-Cd Solder Alloy

Category Metal , Nonferrous Metal , Bismuth Alloy
Manufacturer Indium Corporation of America
Trade Name Indalloy®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Indium Corp. Indalloy® 158 Bi-Pb-Sn-Cd Solder Alloy.pdf
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Material Notes:
Lowest melting point solder. Good fusible alloy used for lens blocking.Information provided by the manufacturer, Indium Corporation.
Physical Properties Metric English Comments
Density 9.58 g/cc
0.346 lb/in³
Mechanical Properties Metric English Comments
Hardness, Brinell 14.5

@Load 4.00 kg
 14.5

@Load 8.82 lb
 2mm ball
Tensile Strength, Ultimate 41.3 MPa
5990 psi
Elongation at Break 120 %
120 %
% elongation on 5.65 (sq. root Area) gauge length
Shear Strength 2.10 MPa
305 psi
Shear Bond Holding Strength
Thermal Properties Metric English Comments
Heat of Fusion 39.8 J/g
17.1 BTU/lb
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
 12.2 µin/in-°F

@Temperature 68.0 °F
Specific Heat Capacity 0.146 J/g-°C
0.0349 BTU/lb-°F
Solid
0.184 J/g-°C
0.0440 BTU/lb-°F
Liquid
Thermal Conductivity 18.0 W/m-K

@Temperature 85.0 °C
 125 BTU-in/hr-ft²-°F

@Temperature 185 °F
Melting Point 70.0 °C
158 °F
Eutectic
Solidus 70.0 °C
158 °F
Liquidus 70.0 °C
158 °F
Component Elements Properties Metric English Comments
Bismuth, Bi 50 %
50 %
Cadmium, Cd 10 %
10 %
Lead, Pb 26.7 %
26.7 %
Tin, Sn 13.3 %
13.3 %
Electrical Properties Metric English Comments
Electrical Resistivity 0.0000430 ohm-cm
0.0000430 ohm-cm
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