Category | Polymer , Adhesive , Thermoset , Epoxy |
Manufacturer | ITW Devcon |
Trade Name | Epoxy Plus™ |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | ITW Devcon Epoxy Plusâ„¢ 25 Grey.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Viscosity | 70000 cP | 70000 cP | Mixed Viscosity |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Elongation at Break | 20 % | 20 % | |
Adhesive Bond Strength | 19.0 MPa | 2750 psi | lap shear (on grit blasted steel, bond line thickness of 0.010"); ASTM D1002 |
Tensile Impact Strength | 21.0 kJ/m² | 10.0 ft-lb/in² | |
Peel Strength | 3.51 - 4.38 kN/m | 20.0 - 25.0 pli |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
Maximum Service Temperature, Air | 93.3 °C | 200 °F | dry |
Minimum Service Temperature, Air | -40.0 °C | -40.0 °F | dry |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Cure Time | 25.0 min | 0.417 hour | Working time |
210 min | 3.50 hour | Fixture time | |
1440 min | 24.0 hour | Functional cure |
Descriptive Properties | Value | Comments |
---|---|---|
Mix ratio (Resin:Hardener) | 1:1 |