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- ITW Devcon 5 minute® Epoxy Gel, Opaque
ITW Devcon 5 minute® Epoxy Gel, Opaque
| Category | Polymer , Adhesive , Thermoset , Epoxy |
| Manufacturer | ITW Devcon |
| Trade Name | 5 minute® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | ITW Devcon 5 minute® Epoxy Gel, Opaque.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Information provided by ITW Devcon
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Elongation at Break | 1.0 % | 1.0 % | |
| Adhesive Bond Strength | 17.2 MPa | 2500 psi | lap shear (on grit blasted steel, bond line thickness of 0.010"); ASTM D1002 |
| Tensile Impact Strength | 13.6 kJ/m² | 6.50 ft-lb/in² | |
| Peel Strength | 0.351 - 0.526 kN/m | 2.00 - 3.00 pli |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 93.3 °C | 200 °F | dry |
| Minimum Service Temperature, Air | -40.0 °C | -40.0 °F | dry |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 4.00 - 7.00 min | 0.0667 - 0.117 hour | Working time |
| 10.0 - 15.0 min | 0.167 - 0.250 hour | Fixture time | |
| 45.0 - 60.0 min | 0.750 - 1.00 hour | Functional cure |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Mix ratio (Resin:Hardener) | 1:1 |
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