Hexcel® Redux® 775 Vinyl phenolic structural adhesive

Category	Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive , Phenolic
Manufacturer	Hexcel
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexcel® Redux® 775 Vinyl phenolic structural adhesive.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Redux 775 was adopted as the world's first metal-to-metal bonding process to be officially approved for use in the manufacture of aircraft primary structures in 1943. It is available either as a film or as a two component system, Redux 775 "Liquid" and Redux 775 "Powder", both systems requiring heat and pressure for curing.Features: Outstanding long term weathering and corrosion resistance; Outstanding resistance to commonly used aircraft fluids; Insensitive to atmospheric moisture before and after curing; High shear and peel strength in the temperature range -67°F to 160°F.Applications: Metal to metal bonding; Rubber bonding; Wood bonding.

Physical Properties	Metric	English	Comments
Storage Temperature	0.000 - 4.44 °C	32.0 - 40.0 °F	Film and Liquid

Mechanical Properties	Metric	English	Comments
Shear Strength	20.7 MPa @Temperature 71.1 °C	3000 psi @Temperature 160 °F	Tensile Shear, Redux 775 film
	31.0 MPa @Temperature 21.1 °C	4500 psi @Temperature 70.0 °F	Tensile Shear, Redux 775 Liquid & Powder (P:L Ration = 1.3:1)
	37.2 MPa @Temperature 21.1 °C	5400 psi @Temperature 70.0 °F	Tensile Shear, Redux 775 film
Peel Strength	10.5 kN/m @Temperature 21.1 °C	60.0 pli @Temperature 70.0 °F	Metal to Metal Peel, Redux 775 Liquid & Powder (P:L Ration = 1.3:1)
	10.7 kN/m @Temperature 21.1 °C	61.0 pli @Temperature 70.0 °F	Metal to Metal Peel, Redux 775 film

Descriptive Properties	Value	Comments
Areal Weight (psf)	0.075
Roll Width (in)	24
Standard Roll (ft2)	270

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