Material Notes:
Redux 610 is a modified, flame-retarded epoxy film adhesive curing at 250°F. It is suitable for bonding metal to metal and for sandwich structures where flame retardancy and low heat release are required. Redux 610 is a hot melt film which is free from solvents and consequently has a very low volatile content.Features: Cures in 1 hour at 250°F; Good lap-shear performance up to 212°F; Good peel performance in sandwich structures up to 175°F; Meets the heat release requirements of IMO test MSC 61 (67); Good tack, drape and handleability; Very low volatile content and low out gassing properties; Available unsupported or with a very lightweight glass carrier.Applications: Metal to metal bonding; Sandwich constructions; Flame retarded performance