Hexcel® Redux® 609 (0.04 psf) Adhesive film for bonding metallic and composite components

Category	Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Hexcel
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexcel® Redux® 609 (0.04 psf) Adhesive film for bonding metallic and composite components.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Redux 609 is a 250°F curing modified epoxy film adhesive containing a cottom scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 0.06 psf and 0.04 psf and is also available unsupported at 0.06 psf.Features: Flexible cure cycle; Good lap shear performance at temperatures ranging from -67°F to 180°F; Good peel properties from -67°F to 180°F; Good tack to assist in adhesive joint assembly; Less than 1% volatile content; Suitable for bonding a wide range of substrates.Applications: Aluminum to aluminum bonding; Sandwich bonding with a variety of skins and cores

Physical Properties	Metric	English	Comments
Storage Temperature	-17.8 °C	0.000 °F

Mechanical Properties	Metric	English	Comments
Tensile Strength, Yield	4.48 MPa	650 psi	Flatwise Tensile
Shear Strength	31.0 MPa @Temperature 21.1 °C	4500 psi @Temperature 70.0 °F	Lap Shear
	31.0 MPa @Temperature 48.9 °C	4500 psi @Temperature 120 °F	Lap Shear

Processing Properties	Metric	English	Comments
Shelf Life	12.0 Month @Temperature -17.8 °C	12.0 Month @Temperature 0.000 °F

Descriptive Properties	Value	Comments
Areal Weight (psf)	0.04
Roll Width (in)	49
Standard Roll (ft2)	1075
Support	Cotton Scrim

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