Hexcel® Redux® 609 (0.04 psf) Adhesive film for bonding metallic and composite components

Redux 609 is a 250°F curing modified epoxy film adhesive containing a cottom scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 0.06 psf and 0.04 psf and is also available unsupported at 0.06 psf.Features: Flexible cure cycle; Good lap shear performance at temperatures ranging from -67°F to 180°F; Good peel properties from -67°F to 180°F; Good tack to assist in adhesive joint assembly; Less than 1% volatile content; Suitable for bonding a wide range of substrates.Applications: Aluminum to aluminum bonding; Sandwich bonding with a variety of skins and cores