Hexcel® Redux® 340U(SP) (0.01 psf) Modified epoxy film adhesive for bonding metallic and composite components

Redux® 340U(SP) is a high temperature modified epoxy film adhesive curing at 175°C (350°F). It was developed as a low weight film adhesive for space applications. It is suitable for bonding metal to metal, where operating temperatures are experienced up to 200°C (392°F) for short periods, or 180°C (356°F) for continuous operation. Redux® 340U(SP) is a hot melt film which is free from solvents and consequently has a very low volatile content.Features: Cures in 1 hour at 175°C (350°F); Good hot lap shear performance up to 180°C(356°F); Excellent metal-metal peel properties; Excellent drape and handleability; Good reticulating characteristics; very low volatile content and low outgassing properties; Only available un-supported.Applications: Metal to metal bonding; Composite to composite bonding; Space applications.