Hexcel® HexPly® F650 Bismaleimide Resin

HexPly® F650 is a bismaleimide resin that cures via an additional/free radical mechanism resulting in a cross-linked thermoset system with no condensation by-products. HexPly® F650 was developed by Hexcel to overcome existing limitations for use on complex structures and ducting in advanced military aircraft, helicopters, and many other high temperature applications. HexPly® F650 simplifies fabrications and delivers a more cost-effective end product.Advantages: Viscous, homogenous; Simple, adjustable, reaction kinetics; No resin advancement at room temperature; Simple processing and impregnation; High glass temperature relative to post cure, Dimensionally stable at greater than 500°F (260°C); High laminate mechanical strengths and strains; modest cost; Non-micro cracking for woven laminates