Hexcel® HexPly® 954-2A Curing Cyanate Resin

Category	Polymer , Thermoset , Epoxy
Manufacturer	Hexcel
Trade Name	HexPly®
Port	Ningbo port,China
Trade Terms	EXW, FOB, CFR, CIF
Payment Terms	L/C, T/T, PayPal
Download PDF	Hexcel® HexPly® 954-2A Curing Cyanate Resin.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

HexPly® 954-2A is a 350°F (177°C) curing toughened cyanate resin with low moisture absorption, and excellent microcracking resistance. HexPly® 954-2A is formulated for autoclave or press molding. Recommended curing is two hours at 350°F (177°C). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C3.Typical applications for HexPly® 954-2A include primary and secondary aircraft structure, space structures, cryogenic tanks, or any application where impact resistance, light weight and excellent dielectric properties are required. HexPly® 954-2A can be impregnated via hot melt or solution techniques on all available fibers and fabrics.Information provided by HexCel

Physical Properties	Metric	English	Comments
Density	1.24 g/cc	0.0448 lb/in³

Mechanical Properties	Metric	English	Comments
Tensile Strength, Yield	69.0 MPa <br>@Temperature 23.0 °C	10000 psi <br>@Temperature 73.4 °F
Elongation at Break	2.59 %	2.59 %
Tensile Modulus	3.00 GPa <br>@Temperature 23.0 °C	435 ksi <br>@Temperature 73.4 °F
Flexural Yield Strength	82.0 MPa <br>@Temperature 163 °C	11900 psi <br>@Temperature 325 °F	Wet (Immersion at 170°F for 7 days)
	87.0 MPa <br>@Temperature 177 °C	12600 psi <br>@Temperature 351 °F
	93.0 MPa <br>@Temperature 163 °C	13500 psi <br>@Temperature 325 °F
	117 MPa <br>@Temperature 23.0 °C	17000 psi <br>@Temperature 73.4 °F
Flexural Modulus	2.30 GPa <br>@Temperature 163 °C	334 ksi <br>@Temperature 325 °F	Wet (Immersion at 170°F for 7 days)
	2.40 GPa <br>@Temperature 163 °C	348 ksi <br>@Temperature 325 °F
	2.40 GPa <br>@Temperature 177 °C	348 ksi <br>@Temperature 351 °F
	3.00 GPa <br>@Temperature 23.0 °C	435 ksi <br>@Temperature 73.4 °F
Poissons Ratio	0.38	0.38
Shear Modulus	1.09 GPa	158 ksi	Calculated

Thermal Properties	Metric	English	Comments
CTE, linear	50.8 µm/m-°C	28.2 µin/in-°F
Glass Transition Temp, Tg	191 °C	376 °F

Electrical Properties	Metric	English	Comments
Dielectric Constant	2.92	2.92
	2.92	2.92
	3.13 <br>@Frequency 1.00e+10 Hz	3.13 <br>@Frequency 1.00e+10 Hz	Moisture Conditioned: 71°C and 95% RH for 140 days; Room Temperature; ASTM D2520
	3.29 <br>@Frequency 1.00e+10 Hz,<br> Temperature 163 °C	3.29 <br>@Frequency 1.00e+10 Hz,<br> Temperature 325 °F	Moisture Conditioned: 71°C and 95% RH for 140 days; ASTM D2520
Dielectric Loss Index	0.0080 <br>@Temperature 23.0 °C	0.0080 <br>@Temperature 73.4 °F
	0.010 <br>@Temperature 163 °C	0.010 <br>@Temperature 325 °F
	0.010 <br>@Frequency 1.00e+10 Hz	0.010 <br>@Frequency 1.00e+10 Hz	Moisture Conditioned: 71°C and 95% RH for 140 days; Room Temperature; ASTM D2520
	0.020 <br>@Frequency 1.00e+10 Hz,<br> Temperature 163 °C	0.020 <br>@Frequency 1.00e+10 Hz,<br> Temperature 325 °F	Moisture Conditioned: 71°C and 95% RH for 140 days; ASTM D2520

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