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Hexcel® HexPly® 954-2A Curing Cyanate Resin

Category Polymer , Thermoset , Epoxy
Manufacturer Hexcel
Trade Name HexPly®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® HexPly® 954-2A Curing Cyanate Resin.pdf
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Material Notes:
HexPly® 954-2A is a 350°F (177°C) curing toughened cyanate resin with low moisture absorption, and excellent microcracking resistance. HexPly® 954-2A is formulated for autoclave or press molding. Recommended curing is two hours at 350°F (177°C). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C3.Typical applications for HexPly® 954-2A include primary and secondary aircraft structure, space structures, cryogenic tanks, or any application where impact resistance, light weight and excellent dielectric properties are required. HexPly® 954-2A can be impregnated via hot melt or solution techniques on all available fibers and fabrics.Information provided by HexCel
Physical Properties Metric English Comments
Density 1.24 g/cc
0.0448 lb/in³
Mechanical Properties Metric English Comments
Tensile Strength, Yield 69.0 MPa

@Temperature 23.0 °C
10000 psi

@Temperature 73.4 °F
Elongation at Break 2.59 %
2.59 %
Tensile Modulus 3.00 GPa

@Temperature 23.0 °C
435 ksi

@Temperature 73.4 °F
Flexural Yield Strength 82.0 MPa

@Temperature 163 °C
11900 psi

@Temperature 325 °F
Wet (Immersion at 170°F for 7 days)
87.0 MPa

@Temperature 177 °C
12600 psi

@Temperature 351 °F
93.0 MPa

@Temperature 163 °C
13500 psi

@Temperature 325 °F
117 MPa

@Temperature 23.0 °C
17000 psi

@Temperature 73.4 °F
Flexural Modulus 2.30 GPa

@Temperature 163 °C
334 ksi

@Temperature 325 °F
Wet (Immersion at 170°F for 7 days)
2.40 GPa

@Temperature 163 °C
348 ksi

@Temperature 325 °F
2.40 GPa

@Temperature 177 °C
348 ksi

@Temperature 351 °F
3.00 GPa

@Temperature 23.0 °C
435 ksi

@Temperature 73.4 °F
Poissons Ratio 0.38
0.38
Shear Modulus 1.09 GPa
158 ksi
Calculated
Thermal Properties Metric English Comments
CTE, linear 50.8 µm/m-°C
28.2 µin/in-°F
Glass Transition Temp, Tg 191 °C
376 °F
Electrical Properties Metric English Comments
Dielectric Constant 2.92
2.92
2.92
2.92
3.13

@Frequency 1.00e+10 Hz
3.13

@Frequency 1.00e+10 Hz
Moisture Conditioned: 71°C and 95% RH for 140 days; Room Temperature; ASTM D2520
3.29

@Frequency 1.00e+10 Hz,
Temperature 163 °C
3.29

@Frequency 1.00e+10 Hz,
Temperature 325 °F
Moisture Conditioned: 71°C and 95% RH for 140 days; ASTM D2520
Dielectric Loss Index 0.0080

@Temperature 23.0 °C
0.0080

@Temperature 73.4 °F
0.010

@Temperature 163 °C
0.010

@Temperature 325 °F
0.010

@Frequency 1.00e+10 Hz
0.010

@Frequency 1.00e+10 Hz
Moisture Conditioned: 71°C and 95% RH for 140 days; Room Temperature; ASTM D2520
0.020

@Frequency 1.00e+10 Hz,
Temperature 163 °C
0.020

@Frequency 1.00e+10 Hz,
Temperature 325 °F
Moisture Conditioned: 71°C and 95% RH for 140 days; ASTM D2520
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