Material Notes:
Specifically developed to meet the demands of aggressive dry plasma systems and the corresponding remote O2 cleaning processes, Chemraz® 644, a perfluoroelastomer with a unique formulation, provides enhanced plasma resistance and minimal contamination resulting in less downtime and higher wafer processing yields. Recommended primarily for both static and dynamic oxide etch wafer processing applications, Chemraz 644 remains stable at service temperatures up to 315°C (600°F).Applications:Endpoint windowsBell jar sealsValve sealsKF fitting sealsWindow sealsIsolator valve sealsLid sealsGas inlet sealsSlit valves sealsChamber sealsInformation provided by Greene Tweed.