Material Notes:
Made from natural graphite, eGRAF® HITHERM™ thermal interface materials are designed for use in applications requiring low contact resistance and high thermal conductivity. HITHERM™ material is offered in a variety of through thickness thermal conductivities, available in roll or die-cut form and can be laminated with plastics and adhesives. An economical thermal interface material, HITHERM™ products will not dry out and no outgassing occurs under vacuum conditions. The conformability of HITHERM™ materials optimizes thermal properties, ensures excellent contact, and is maintained for the life of the assembly. Typical applications include thermal interfaces, chip burn-in, chip testing fixtures, DC-to-DC converters, CPU modules, microprocessors, and hot and cold plates.