Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy

Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheology provides a smooth paste with excellent handling characteristics and a reasonable pot life. It can be machine-dispensed, screen printed, stamped, or applied by hand using spatula, toothpick, or many other applicators.Suggested for the following:Semiconductor applications such as Au-plated chips, Si, GaAs, Cu or Ag based lead-frames and die-paddles, JEDEC plastic IC packaging using transfer molded encapsulation processes.Hybrid micro-electronics; active and passive SMDs on ceramic substrates, Au and Ag-Pd contact pads, chip caps and resistors, inductors, quartz crystals, oscillators, making or repairing conductive traces on the PCB, EMI/RF shielding of the package, near-hermetic sealing, component or package grounding. Packages like DIP, or TO-can format.PCB level; COB die attach, substrates can be rigid like FR4 and BT, or flex like Kapton.Passes NASA low outgassing standard ASTM E595 with proper cureDesigned to withstand TC wire bonding temperatures, or hybrid lid-seal processes exceeding 300°C.Information Provided by Epoxy Technology