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Epoxy Technology EPO-TEK® ED1021 Epoxy

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® ED1021 Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its ability to achieve high thermal conductivity values at low cure temperatures and a very shiny silver appearance which enhances overall LED brightness. Other benefits include long pot-life, low viscosity and high thixotropy making it ideal for wafer level stamping as well as syringe dispensing.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	2.80 g/cc	2.80 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	1819 cP @Temperature 23.0 °C	1819 cP @Temperature 73.4 °F	100 rpm
	8782 cP @Temperature 23.0 °C	8782 cP @Temperature 73.4 °F	10 rpm
	37282 cP @Temperature 23.0 °C	37282 cP @Temperature 73.4 °F	1 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	82	82
Tensile Modulus	0.1782 GPa	25.85 ksi	Storage

Thermal Properties	Metric	English	Comments
CTE, linear	5.20 µm/m-°C	2.89 µin/in-°F	Below Tg
	184 µm/m-°C	102 µin/in-°F	Above Tg
Thermal Conductivity	3.30 W/m-K	22.9 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 48.0 °C	>= 118 °F
Decomposition Temperature	403 °C	757 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00020 ohm-cm	<= 0.00020 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	3.0 ppm	3.0 ppm
Ionic Impurities - K (Potassium)	1.0 ppm	1.0 ppm
Ionic Impurities - Cl (Chloride)	<= 10 ppm	<= 10 ppm

Processing Properties	Metric	English
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
Pot Life	129600 min	129600 min
Shelf Life	12.0 Month @Temperature -40.0 °C	12.0 Month @Temperature -40.0 °F

Descriptive Properties	Value	Comments
Color	Silver
Consistency	Smooth thixotropic paste
Die Shear	12 kg	After 1000hrs 85°C/85% RH
	12.4 kg	Initial
Ionic Impurities NH4	9 ppm
Number of Components	Single
Thixotropic Index	4.2
Weight Loss	0.35%	200°C
	0.41%	250°C
	0.56%	300°C

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