Dielectric Polymers NT-5900HL Hot Air Leveling Tape (discontinued **)

Category	Polymer , Adhesive , Tape , Thermoset , Polyester, TS , Silicone
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Dielectric Polymers NT-5900HL Hot Air Leveling Tape (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Crosslinked silicone adhesive with polyester film and crepe paper backing.Features: High temperature resistantNo adhesive residue even when there is a delay between wave soldering and tape removalGood conformabilityApplications: For protecting gold finger contacts during wave soldering and hot air leveling of PCBs.Information provided by Dielectric Polymers.

Physical Properties	Metric	English	Comments
Thickness	76.2 microns	3.00 mil	Adhesive
	178 microns	7.00 mil	Backing

Mechanical Properties	Metric	English	Comments
Elongation at Break	5.0 %	5.0 %
Peel Strength	0.2302 kN/m	1.313 pli	Adhesion
	7.54 kN/m	43.0 pli	Tensile

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	250 °C	482 °F

Descriptive Properties	Value	Comments
Color	White

Users viewing this material also viewed the following: