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Dielectric Polymers NT-5900HL Hot Air Leveling Tape  (discontinued **)

Category Polymer , Adhesive , Tape , Thermoset , Polyester, TS , Silicone
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Dielectric Polymers NT-5900HL Hot Air Leveling Tape  (discontinued **).pdf
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Material Notes:
Crosslinked silicone adhesive with polyester film and crepe paper backing.Features: High temperature resistantNo adhesive residue even when there is a delay between wave soldering and tape removalGood conformabilityApplications: For protecting gold finger contacts during wave soldering and hot air leveling of PCBs.Information provided by Dielectric Polymers.
Physical Properties Metric English Comments
Thickness 76.2 microns
3.00 mil
Adhesive
178 microns
7.00 mil
Backing
Mechanical Properties Metric English Comments
Elongation at Break 5.0 %
5.0 %
Peel Strength 0.2302 kN/m
1.313 pli
Adhesion
7.54 kN/m
43.0 pli
Tensile
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 250 °C
482 °F
Descriptive Properties Value Comments
Color White
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