Cookson Group Plaskon® 150.401 Encapsulation Resin (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 150.401 Encapsulation Resin (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.A second generation SMT-B family product. This material is the initial developmental, general purpose SMT-B encapsulation grade resin and has good adhesion to solder resist with no plasma or UV/Ozone cleaning for PBGA applications.

Physical Properties	Metric	English	Comments
Density	1.90 g/cc	0.0686 lb/in³
Viscosity	8200 cP @Temperature 175 °C	8200 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Spiral Flow	74.0 cm	29.1 in	175°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	88	88
Flexural Strength	76.0 MPa	11000 psi
Flexural Modulus	18.0 GPa	2610 ksi

Thermal Properties	Metric	English
CTE, linear	15.5 µm/m-°C @Temperature 20.0 °C	8.61 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	55.5 µm/m-°C @Temperature 20.0 °C	30.8 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	220 °C	428 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Electrical Resistivity	4.70e+16 ohm-cm	4.70e+16 ohm-cm
Dielectric Constant	3.6 @Frequency 1000 Hz	3.6 @Frequency 1000 Hz
Dissipation Factor	0.0020 @Frequency 1000 Hz	0.0020 @Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

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