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Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material

Category Polymer , Thermoset , Vinyl Ester
Manufacturer BMC - Bulk Molding Compounds Inc.
Trade Name BMC
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material.pdf
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Material Notes:
Product Introduction: Bulk Molding Compounds, Inc. is the largest manufacturer of thermoset bulk molding compounds in North America, serving the automotive, appliance, and electrical markets. BMC thermosets are the most cost-effective plastic products on the market today. The process of manufacturing BMC thermosets is geared toward high-volume, automated systems to ensure the highest quality at the lowest possible cost. BMC thermosets can be designed to conduct electricity for use in applications such as bipolar plates that are used in fuel cells. A fuel cell is an electro-chemical device capable of generating electricity from oxygen and hydrogen. BMC has developed a cost-effective product for use in bipolar plates within direct methanol fuel cell stacks (DMFC). This material utilizes a special vinyl ester resin that is resists up to 100% methanol immersion at 65°C.Information provided by Bulk Molding Compounds
Physical Properties Metric English Comments
Specific Gravity 1.89 g/cc
1.89 g/cc
ASTM D792
Water Absorption <= 0.060 %

@Temperature 23.0 °C,
Time 86400 sec
<= 0.060 %

@Temperature 73.4 °F,
Time 24.0 hour
ASTM D570
Linear Mold Shrinkage 0.00080 cm/cm
0.00080 in/in
ASTM D955
Mechanical Properties Metric English Comments
Tensile Strength at Break 28.0 MPa
4060 psi
ASM D638
Tensile Modulus 9.50 GPa
1380 ksi
ASTM D638
Flexural Yield Strength 38.0 MPa
5510 psi
ASTM D790
Flexural Modulus 10.5 GPa
1520 ksi
ASTM D790
Thermal Properties Metric English Comments
Specific Heat Capacity 0.846 J/g-°C
0.202 BTU/lb-°F
E1461-92
Thermal Conductivity 13.4 W/m-K
93.0 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 189 °C
372 °F
Flammability, UL94 V-0

@Thickness 3.56 mm
V-0

@Thickness 0.140 in
Electrical Properties Metric English Comments
Volume Resistivity 0.0143 ohm-cm
0.0143 ohm-cm
In Plane (X,Y direction)
0.03125 ohm-cm
0.03125 ohm-cm
Through Plane (Z direction)
Processing Properties Metric English Comments
Mold Temperature 149 - 160 °C
300 - 320 °F
Cure Time 0.500 - 1.00 min
0.00833 - 0.0167 hour
Descriptive Properties Value Comments
Diffusivity 0.0889 cm2/s
DMA-Modulus 13.8
@ 25°C, ASTM D4065
3.1
@ 200°C, ASTM D4065
5.4
@ 175°C, ASTM D4065
6.8
@ 150°C, ASTM D4065
9.6
@ 100°C, ASTM D4065
Flowability 270 cm2
Post bake, 350°F 15 mins
after reaching 350°f
Press Close Speed <2 sec
after material begins flowing
Recommended tonnage >40 Mpa
on projected part area
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