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Atom Adhesives AA-BOND FDA8 Epoxy Adhesive

Category	Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Atom Adhesives
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Atom Adhesives AA-BOND FDA8 Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

AA-BOND FDA8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration (FDA) Chapter 1, Sub Part B, Sections 175.105 and 175.300.Appearance: AmberCure Type: Heat cure or Room TemperatureBenefits:Low viscosityEasily mixedEffective electrical insulatorLow permeability to gases and vapors Mix Ratio by weight: 100:100/Resin:HardenerTypical Application: FDA Grade Applications, food packaging, indirect contact with food and medical applicationsInformation provided by Atom Adhesives

Physical Properties	Metric	English	Comments
Specific Gravity	1.11 g/cc	1.11 g/cc	mixed, uncured
Solids Content	100 %	100 %	reactive, uncured
Viscosity	1500 cP	1500 cP	After mixing, uncured

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	65	65	cured

Thermal Properties	Metric	English
CTE, linear	52.9 µm/m-°C	29.4 µin/in-°F
Maximum Service Temperature, Air	145 °C	293 °F
Minimum Service Temperature, Air	-70.0 °C	-94.0 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+14 ohm-cm	1.00e+14 ohm-cm
Dielectric Constant	3.35 @Frequency 1000 Hz	3.35 @Frequency 1000 Hz
Dielectric Strength	16.1 kV/mm	410 kV/in	cured
Dissipation Factor	0.020 @Frequency 1000 Hz	0.020 @Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Pot Life	45.0 min	45.0 min	uncured

Descriptive Properties	Value	Comments
Thixotropic Index	1

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