Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply

Category Polymer , Thermoset
Manufacturer Arlon
Trade Name GenClad™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Low loss Ceramic-Filled Thermoset/Thermoplastic Hybrid SystemRivals PTFE laminate electrical performance in a Halogen-Free systemLight weight material relative to standard laminate materialsOptimal Price/Performance ratio for cost-sensitive applicationsBenefits:Greater signal integrityUtilizes Standard FR-4 ProcessesExcellent Thermal PropertiesLow weight, low-cost electronicsTypical Applications:Cellular Base Station Antennas & Power Amplifiers, Down ConvertersLNBs for direct broadcast satellite systemsBroadband wireless access antennasAvionic radar applicationsInformation provided by Arlon Materials for Electronics (MED).
Physical Properties Metric English Comments
Density 1.35 g/cc
0.0488 lb/in³
ASTM D792 Method A
Water Absorption 0.040 %
0.040 %
IPC TM-650 2.6.2.1
Mechanical Properties Metric English Comments
Tensile Strength 51.0 MPa
7400 psi
Cross; IPC TM-650 2.4.18.3
53.8 MPa
7800 psi
Machine; IPC TM-650 2.4.18.3
Modulus of Elasticity 4.62 GPa
670 ksi
IPC TM-650 2.4.18.3
Flexural Strength 214 MPa
31000 psi
IPC TM-650 2.4.4
221 MPa
32000 psi
IPC TM-650 2.4.4
Compressive Modulus 11.2 GPa
1630 ksi
ASTM D3410
Poissons Ratio 0.25
0.25
ASTM D3039
Shear Modulus 1.85 GPa
268 ksi
Calculated
Peel Strength 1.14 kN/m
6.50 pli
To Copper (1 oz./35 micron; IPC TM-650 2.4.8
1.17 kN/m
6.70 pli
To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 26.0 µm/m-°C

@Temperature 50.0 - 120 °C
14.4 µin/in-°F

@Temperature 122 - 248 °F
IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 50.0 µm/m-°C

@Temperature <=130 °C
27.8 µin/in-°F

@Temperature <=266 °F
z, below Tg; IPC TM-650 2.4.24
350 µm/m-°C

@Temperature >=130 °C
194 µin/in-°F

@Temperature >=266 °F
z, above Tg; IPC TM-650 2.4.24
Thermal Conductivity 0.200 W/m-K

@Temperature 100 °C
1.39 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1225
Glass Transition Temp, Tg 130 °C
266 °F
TMA; IPC TM-650 2.4.24
135 °C
275 °F
DSC; IPC TM-650 2.4.25
Decomposition Temperature 420 °C
788 °F
Onset; IPC TM-650 2.4.24.6
460 °C
860 °F
5 percent; IPC TM-650 2.4.24.6
Electrical Properties Metric English Comments
Volume Resistivity 7.50e+14 ohm-cm
7.50e+14 ohm-cm
E24/125; IPC TM-650 2.5.17.1
2.10e+15 ohm-cm
2.10e+15 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 1.90e+14 ohm
1.90e+14 ohm
C96/35/90; IPC TM-650 2.5.17.1
7.50e+14 ohm
7.50e+14 ohm
E24/125; IPC TM-650 2.5.17.1
Dielectric Constant 2.8

@Frequency 1.00e+10 Hz
2.8

@Frequency 1.00e+10 Hz
C23/50; IPC TM-650 2.5.5.5
2.83

@Frequency 1.00e+6 Hz
2.83

@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
Dielectric Strength 39.4 kV/mm
1000 kV/in
IPC TM-650 2.5.6.2
Dielectric Breakdown 40800 V
40800 V
IPC TM-650 2.5.6
Dissipation Factor 0.0017

@Frequency 1.00e+6 Hz
0.0017

@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
0.0020

@Frequency 1.00e+10 Hz
0.0020

@Frequency 1.00e+10 Hz
C23/50; IPC TM-650 2.5.5.5
Arc Resistance 126 sec
126 sec
IPC TM-650 2.5.1
Descriptive Properties Value Comments
Temperature Coefficient of Dielectric (ppm/°C) -60
IPC TM-650 2.5.5.5 (-0 - 100°C)
Z-Axis Expansion (%) 4.8
IPC TM-650 2.4.24 (50-260°C)
Copyright © lookpolymers.com All Rights Reserved