Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply

Category	Polymer , Thermoset
Manufacturer	Arlon
Trade Name	GenClad™
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Low loss Ceramic-Filled Thermoset/Thermoplastic Hybrid SystemRivals PTFE laminate electrical performance in a Halogen-Free systemLight weight material relative to standard laminate materialsOptimal Price/Performance ratio for cost-sensitive applicationsBenefits:Greater signal integrityUtilizes Standard FR-4 ProcessesExcellent Thermal PropertiesLow weight, low-cost electronicsTypical Applications:Cellular Base Station Antennas & Power Amplifiers, Down ConvertersLNBs for direct broadcast satellite systemsBroadband wireless access antennasAvionic radar applicationsInformation provided by Arlon Materials for Electronics (MED).

Physical Properties	Metric	English	Comments
Density	1.35 g/cc	0.0488 lb/in³	ASTM D792 Method A
Water Absorption	0.040 %	0.040 %	IPC TM-650 2.6.2.1

Mechanical Properties	Metric	English	Comments
Tensile Strength	51.0 MPa	7400 psi	Cross; IPC TM-650 2.4.18.3
	53.8 MPa	7800 psi	Machine; IPC TM-650 2.4.18.3
Modulus of Elasticity	4.62 GPa	670 ksi	IPC TM-650 2.4.18.3
Flexural Strength	214 MPa	31000 psi	IPC TM-650 2.4.4
	221 MPa	32000 psi	IPC TM-650 2.4.4
Compressive Modulus	11.2 GPa	1630 ksi	ASTM D3410
Poissons Ratio	0.25	0.25	ASTM D3039
Shear Modulus	1.85 GPa	268 ksi	Calculated
Peel Strength	1.14 kN/m	6.50 pli	To Copper (1 oz./35 micron; IPC TM-650 2.4.8
	1.17 kN/m	6.70 pli	To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8

Thermal Properties	Metric	English	Comments
CTE, linear	26.0 µm/m-°C @Temperature 50.0 - 120 °C	14.4 µin/in-°F @Temperature 122 - 248 °F	IPC TM-650 2.4.24
CTE, linear, Transverse to Flow	50.0 µm/m-°C @Temperature <=130 °C	27.8 µin/in-°F @Temperature <=266 °F	z, below Tg; IPC TM-650 2.4.24
	350 µm/m-°C @Temperature >=130 °C	194 µin/in-°F @Temperature >=266 °F	z, above Tg; IPC TM-650 2.4.24
Thermal Conductivity	0.200 W/m-K @Temperature 100 °C	1.39 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1225
Glass Transition Temp, Tg	130 °C	266 °F	TMA; IPC TM-650 2.4.24
	135 °C	275 °F	DSC; IPC TM-650 2.4.25
Decomposition Temperature	420 °C	788 °F	Onset; IPC TM-650 2.4.24.6
	460 °C	860 °F	5 percent; IPC TM-650 2.4.24.6

Electrical Properties	Metric	English	Comments
Volume Resistivity	7.50e+14 ohm-cm	7.50e+14 ohm-cm	E24/125; IPC TM-650 2.5.17.1
	2.10e+15 ohm-cm	2.10e+15 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance	1.90e+14 ohm	1.90e+14 ohm	C96/35/90; IPC TM-650 2.5.17.1
	7.50e+14 ohm	7.50e+14 ohm	E24/125; IPC TM-650 2.5.17.1
Dielectric Constant	2.8 @Frequency 1.00e+10 Hz	2.8 @Frequency 1.00e+10 Hz	C23/50; IPC TM-650 2.5.5.5
	2.83 @Frequency 1.00e+6 Hz	2.83 @Frequency 1.00e+6 Hz	IPC TM-650 2.5.5.3
Dielectric Strength	39.4 kV/mm	1000 kV/in	IPC TM-650 2.5.6.2
Dielectric Breakdown	40800 V	40800 V	IPC TM-650 2.5.6
Dissipation Factor	0.0017 @Frequency 1.00e+6 Hz	0.0017 @Frequency 1.00e+6 Hz	IPC TM-650 2.5.5.3
	0.0020 @Frequency 1.00e+10 Hz	0.0020 @Frequency 1.00e+10 Hz	C23/50; IPC TM-650 2.5.5.5
Arc Resistance	126 sec	126 sec	IPC TM-650 2.5.1

Descriptive Properties	Value	Comments
Temperature Coefficient of Dielectric (ppm/°C)	-60	IPC TM-650 2.5.5.5 (-0 - 100°C)
Z-Axis Expansion (%)	4.8	IPC TM-650 2.4.24 (50-260°C)

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