Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate

Category	Polymer , Thermoplastic , Fluoropolymer , PTFE
Manufacturer	Arlon
Trade Name	CuClad
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate.pdf
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Material Notes:

CuClad 217 uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offer faster signal propagation and higher signal/noise ratios.Cross Plied Woven Fiberglass, alternating plies are oriented 90° to each otherHigh PTFE to Glass RatioBetter dielectric constant uniformity than comparable non-woven fiberglass reinforced laminatesBenefits:Electrical and Mechanical isotropy in the X-Y PlaneExtremely Low LossWell Suited for Er Sensitive CircuitsTypical Applications:Military Electronics (Radars, ECM, ESM)Microwave Components (Filters, Couplers, LNAs, etc.)Information provided by Arlon Materials for Electronics (MED).

Physical Properties	Metric	English	Comments
Density	2.23 g/cc	0.0806 lb/in³	ASTM D792 Method A
Water Absorption	0.020 %	0.020 %	IPC TM-650 2.6.2.2
Outgassing - Total Mass Loss	0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F	Water Vapor Recovered; NASA SP-R-0022A
	0.010 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	0.010 % @Pressure <=1.93e-8 psi, Temperature 257 °F	Collected Volatiles; NASA SP-R-0022A
	0.010 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	0.010 % @Pressure <=1.93e-8 psi, Temperature 257 °F	NASA SP-R-0022A

Mechanical Properties	Metric	English	Comments
Tensile Strength	45.5 MPa	6600 psi	Cross; ASTM D882
	60.7 MPa	8800 psi	Machine; ASTM D882
Modulus of Elasticity	1.51 GPa	219 ksi	Cross; ASTM D638
	1.90 GPa	275 ksi	Machine; ASTM D638
Flexural Modulus	>= 2.46 GPa	>= 357 ksi	ASTM D790
Compressive Modulus	1.63 GPa	237 ksi	ASTM D695
Peel Strength	2.45 kN/m	14.0 pli	After Thermal Stress; IPC TM-650 2.4.8

Thermal Properties	Metric	English	Comments
CTE, linear	28.0 µm/m-°C @Temperature 0.000 - 100 °C	15.6 µin/in-°F @Temperature 32.0 - 212 °F	y direction; IPC TM-650 2.4.24
	29.0 µm/m-°C @Temperature 0.000 - 100 °C	16.1 µin/in-°F @Temperature 32.0 - 212 °F	x direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow	246 µm/m-°C @Temperature 0.000 - 100 °C	137 µin/in-°F @Temperature 32.0 - 212 °F	z direction; IPC TM-650 2.4.24
Thermal Conductivity	0.261 W/m-K @Temperature 100 °C	1.81 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1225
Flammability, UL94	V-0	V-0	Vertical Burn

Electrical Properties	Metric	English	Comments
Volume Resistivity	2.30e+14 ohm-cm	2.30e+14 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance	3.40e+12 ohm	3.40e+12 ohm	C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant	2.17 - 2.2 @Frequency 1.00e+6 Hz	2.17 - 2.2 @Frequency 1.00e+6 Hz	C23/50; IPC TM-650 2.5.5.3
	2.17 - 2.2 @Frequency 1.00e+10 Hz	2.17 - 2.2 @Frequency 1.00e+10 Hz	C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown	>= 45000 V	>= 45000 V	D48/50; ASTM D149
Dissipation Factor	0.00090 @Frequency 1.00e+10 Hz	0.00090 @Frequency 1.00e+10 Hz	C23/50; IPC TM-650 2.5.5.5
Arc Resistance	>= 180 sec	>= 180 sec	D48/50; ASTM D495

Descriptive Properties	Value	Comments
Temperature Coefficient of Dielectric (ppm/°C)	-151	IPC TM-650 2.5.5.5 (-10 - 140°C)

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