Arlon 85N Polyimide Laminate and Prepreg

85N is a polyimide and laminate prepreg system for PWBs requiring resistance to high temperature, both in process and in end-use application. Bromine-free chemistry provides thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.Low Z-expansion minimizes the risk of latent PTH defects caused during solder reflow and device attachment.Up to 50% or more reduction in cure time compared with traditional polyimide cyclesElectrical and mechanical properties meeting the requirements of IPC-4101/40 and /41Toughened, Non-MDA chemistry resists drill crackingTypical Applications:PCBs that are subjected to high temperatures during processing, such as lead-free solderingApplications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down-hole drilling, under-hood automotive controls, burn-in-boards, or industrial sensorsThis data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.