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Aptek DAT-A-THERM 1000 Electrically insulating urethane film

Category Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive
Manufacturer Aptek Laboratories
Trade Name DAT-A-THERM
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek DAT-A-THERM 1000 Electrically insulating urethane film.pdf
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Material Notes:
DAT-A-THERM 1000 is a tough, flexible, void free, electrically insulating urethane film designed to fill air gaps and dissipate heat between devices and substrates. DAT-A-THERM 1000 film is a 100% solid, fully crosslinked (C-staged), thermoset urethane polymer, which will not outgas, while in place and is suitable for high vacuum environments. The film exhibits outstanding reversion resistance and physical stability under long-term aging of high humidity and heat. The ultimate in thermal conductivity and overall performance can be achieved by bonding DAT-A-THERM 1000 film to device and conductivity and overall performance can be achieved by bonding DAT-A-THERM 1000 film to device and substrate with DIS-A-PASTE 2000A/B and 2001 PMF thermally conductive urethane adhesives. Both film and adhesive system are compatible in resin and filler technologies and have been designed to be used together.Uniform filler distribution for consistent thermal dissipation capability throughput film segment; Controlled manufacturing process for a void free film; Low modulus/high elongation for minimum stress buildup under components; Low Tg-remains flexible to -70ºC; Exceeds NASA outgassing requirements for high vacuum environments; Typical film thicknesses, 0.004 to 0.006 in. Custom thicknesses available; Available in sheet or die-cut formsInformation provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 1.96 g/cc
0.0708 lb/in³
ASTM D1475
Moisture Absorption at Equilibrium 0.15 %
0.15 %
Cured property; ASTM D570
Outgassing - Total Mass Loss 0.17 %
0.17 %
Cured property at 125ºC at 10E-6 torr
Collected Volatile Condensable Material 0.010 %
0.010 %
Cured property at 125ºC; at 10E-6 torr
Mechanical Properties Metric English Comments
Tensile Strength, Ultimate 7.24 MPa

@Thickness 0.127 mm
1050 psi

@Thickness 0.00500 in
Cured; ASTM D638
Elongation at Break 75 %

@Thickness 0.127 mm
75 %

@Thickness 0.00500 in
Cured; ASTM D638
Tensile Modulus 0.0138 GPa

@Thickness 0.127 mm
2.00 ksi

@Thickness 0.00500 in
Cured; ASTM D638
Thermal Properties Metric English Comments
CTE, linear 1.00 µm/m-°C

@Temperature 20.0 °C
0.556 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 1
147 µm/m-°C

@Temperature 20.0 °C
81.7 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 2
Thermal Conductivity 0.962 W/m-K
6.67 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg -70.0 °C
-94.0 °F
Cured property; JMTP P-100
Electrical Properties Metric English Comments
Volume Resistivity 7.00e+14 ohm-cm
7.00e+14 ohm-cm
Cured property; ASTM D257
Dielectric Constant 5.8

@Frequency 1000 Hz
5.8

@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength 39.4 kV/mm

@Thickness 0.127 mm
1000 kV/in

@Thickness 0.00500 in
Cured; ASTM D149
Dissipation Factor 0.030

@Frequency 1000 Hz
0.030

@Frequency 1000 Hz
Cured property; ASTM D150
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