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Aptek 2710A/B Low modulus silicone adhesive

Category Polymer , Adhesive , Thermoset , Silicone
Manufacturer Aptek Laboratories
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 2710A/B Low modulus silicone adhesive.pdf
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Material Notes:
Low modulus silicone adhesive; -110ºC to 260ºC operating range; Low outgassing/space grade; Electrostatically Discharging (ESD)APTEK 2710-A/B is a two component, black, low modulus, thixotropic, silicone adhesive displaying very low temperature flexibility and good physical strength properties. APTEK 2710-A/B has been designed to fully cure at room temperature and can be accelerated with a brief low temperature cure. This 100% solid system has been manufactured with highly pure resins to minimize the occurrence of ionic contamination without outgassing during cure or service.Utilizes silicone technology providing very low Tg for excellent low temperature performance; Convenient 1:1 PBW or PBV mix ration for easy handling - ideal for cartridge dispensers/repair kits; Very flexible/low modulus over wide temperature range to absorb stress build-up during thermal cycling; Very good adhesion to various substrates when used in conjunction with APTEK P-105 primerInformation provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 1.19 g/cc
0.0430 lb/in³
A Component; ASTM D1475
1.19 g/cc
0.0430 lb/in³
B Component; ASTM D1475
Outgassing - Total Mass Loss 0.60 %
0.60 %
Cured property; at 10E-6 torr; ASTM D595
Collected Volatile Condensable Material 0.060 %
0.060 %
Cured property; at 10E-6 torr; ASTM D595
Mechanical Properties Metric English Comments
Hardness, Shore A 35
35
Cured property; ASTM D1002
Adhesive Bond Strength 1.90 MPa
275 psi
Al-to-Al Lap Shear; Cured property; bondline thickness on primed aluminum panels; ASTM D1002
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 260 °C
500 °F
Minimum Service Temperature, Air -110 °C
-166 °F
Glass Transition Temp, Tg -108 °C
-162 °F
Cured property; TMA
Flash Point >= 150 °C
>= 302 °F
A Component; ASTM D92
>= 150 °C
>= 302 °F
B Component; ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 200000 ohm-cm
200000 ohm-cm
Cured property; HSC 51113
Processing Properties Metric English Comments
Processing Temperature 65.0 °C
149 °F
Cure 1 hrs
150 °C
302 °F
Cure 0.25 hrs
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