Aptek 2312-PMF Electrically conductive, low modulus adhesive

Category	Polymer , Adhesive , Thermoset
Manufacturer	Aptek Laboratories
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Aptek 2312-PMF Electrically conductive, low modulus adhesive.pdf
Price	EMAIL US sales@lookpolymers.com
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Material Notes:

Premixed-frozen, electrically conductive, low modulus adhesiveAPTEK 2312-PMF is a one component, premixed-frozen, silver filled, electrically conductive soft paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. APTEK 2312-PMF is a 100% solid, solvent free system that will not form voids during cure or outgas after being fully cured. Premixed-frozen and packaged in syringes for convenient dispensing to circuit board; Low modulus to minimize stress to sensitive components and ceramic substrates; Low Tg for excellent low temperature cycling and performance; Excellent substrate adhesion, superior to silicones; Available with spacer beads for precise bond line controlInformation provided by Aptek Laboratories, Inc.

Physical Properties	Metric	English	Comments
Density	3.60 g/cc	0.130 lb/in³	ASTM D1475
Outgassing - Total Mass Loss	0.60 %	0.60 %	Cured property; at 10E-6 torr; ASTM E-595
Collected Volatile Condensable Material	0.020 %	0.020 %	Cured property; at 10E-6 torr; ASTM E595

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	1.38 MPa	200 psi	Al-to-Al Lap Shear; Cured property, scuff sanded, IPA wiped T3-202Al; cohesive failure; ASTM D1002

Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.76 W/m-K	12.2 BTU-in/hr-ft²-°F	COLORA
Glass Transition Temp, Tg	<= -60.0 °C	<= -76.0 °F	Cured property; JMTP P-200
Flash Point	>= 200 °C	>= 392 °F	ASTM D92

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.0050 ohm-cm	0.0050 ohm-cm	Cured property; ASTM D257

Processing Properties	Metric	English	Comments
Processing Temperature	100 °C	212 °F	Cure 3 hrs

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