Electrical Properties | Metric | English | Comments |
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Volume Resistivity | 2.10e+15 ohm-cm | 2.10e+15 ohm-cm | ASTM D247 |
Plenco 08235 Polyester BMC, Compression Molded PLENCO 08235 is a renumber of PlasGlas 20315. PLENCO 08235 is a 15% glass-filled polyester bulk molding compound characterized as a flame-retardant, medium strength electrical grade. It is suitable .. |
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Volume Resistivity | 2.10e+15 ohm-cm | 2.10e+15 ohm-cm | |
Tra-Con Tra-Bond 2159 Heat Conductive Electrically Insulating Compound TRA-BOND 2159 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.. |
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Volume Resistivity | 2.10e+15 ohm-cm | 2.10e+15 ohm-cm | |
Tra-Con Tra-Bond 2158 Heat Conductive Electrically Insulating Compound TRA-BOND 2158 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.. |
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Volume Resistivity | 2.10e+15 ohm-cm | 2.10e+15 ohm-cm | ASTM D257 |
Arkema Group Orgalloy® RS 6630 Polyamide 6.6 Alloy 30% Glass Fiber reinforced Polyamide Alloy, Rigid grade, Nylon 6.6 basedMolding of Engineering PartsInformation provided by Arkema Group |
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Volume Resistivity | 2.10e+15 ohm-cm | 2.10e+15 ohm-cm | C96/35/90; IPC TM-650 2.5.17.1 |
Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply Low loss Ceramic-Filled Thermoset/Thermoplastic Hybrid SystemRivals PTFE laminate electrical performance in a Halogen-Free systemLight weight material relative to standard laminate materialsOptimal .. |
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Volume Resistivity | 2.10e+15 ohm-cm | 2.10e+15 ohm-cm | |
Atom Adhesives AA-BOND F162 Epoxy Adhesive AA-BOND F162 is a thixotropic electrical insulating epoxy adhesive system with low vapor pressure and outgassing characteristics. AA-BOND F162 was specifically developed for fiber optic, laser, phot.. |