Polymer Property : Back Pressure = 2.00 MPa Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PP CCP20020 UV Polypropylene, Mineral Reinforced, UV stabilized Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC T20020 Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC T3020 Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF1020 PD2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH DGF101015 PB Polypropylene Homopolymer, Glass Fibre/Mineral, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T16040 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPHC K2040H Polypropylene, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPHC K3020 Polypropylene, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC GF15030 PD2 Polypropylene Copolymer, Glass Fiber Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC K6020 S Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC T2020 Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH B8065 VT1 Polypropylene Homopolymer, Mineral Reinforced, Heat Resistant Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF3030 PD2 PP, Glass Fiber-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF5040 PD2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF8030 HC Polypropylene Homopolymer, Glass Fibre-Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF8030 PB Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH K5040 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T3022D Polypropylene Homopolymer, Mineral Reinforced, Detergent Resistant Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T5020 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free (discontinued **) Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof (discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi	Mold Pressure
Beijing Chemical Industry KAIFA® GL6000 ABS Metal Plating Grade Excellent plating performance, Good thermal stabilityInformation provided by Beijing Chemical Industry Research Institute (Group)
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF10020 PD2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF8020 PB Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T5040 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T8030 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..