Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.346 W/m-K | 2.40 BTU-in/hr-ft²-°F | |
Lord Adhesives Circalokâ„¢ 6715 Silicone Encapsulant Circalokâ„¢ 6715 is a two component, medium viscosity, solvent-free silicone which cures at room temperature to an elastomeric, stress-free rubber of outstanding electrical and high temperature p.. |
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Thermal Conductivity | 0.346 W/m-K | 2.40 BTU-in/hr-ft²-°F | ASTM F433 |
Saint-Gobain Meldin® 7001 CM Compression Molded Polyimide Meldin® 7001 CM unfilled polyimide base resin, compression moldedSpecification Qualifications:Satisfies Type I P for ASTM D 6456-99: Standard Specification for Finished Parts Made from Polyimide .. |
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Thermal Conductivity | 0.346 - 0.360 W/m-K | 2.40 - 2.50 BTU-in/hr-ft²-°F | Average value: 0.355 W/m-K Grade Count:3 |
Overview of materials for Polypropylene with 40% Glass Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Polypropylene with 40% Glass Fiber Filler". Specific grades with glass content between 35% and 44% are i.. |