Thermal Properties | Metric | English | Comments |
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CTE, linear | 25.9 µm/m-°C @Temperature 21.1 °C |
14.4 µin/in-°F @Temperature 70.0 °F |
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Parkway Products Thixomolded® AM50A Magnesium Thixomolding® is a fabrication technique, similar to injection molding, that uses magnesium alloys as the “resin” instead of plastic. Solid magnesium alloy pellets are fed into the machine, heate.. |
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CTE, linear | 26.0 µm/m-°C @Temperature 25.0 - 150 °C |
14.4 µin/in-°F @Temperature 77.0 - 302 °F |
ASTM TMA |
PBI Performance Products Celazole® TL-60 Self Lubricating Melt Processable Polybenzimidazole Celazole® polybenzimidazole (PBI) resin is a unique and highly stable linear hetrocyclic polymer. PBI is characterized by high strength; excellent thermal stability, and broad chemical resistance. .. |
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CTE, linear | 26.0 µm/m-°C @Temperature 25.0 - 150 °C |
14.4 µin/in-°F @Temperature 77.0 - 302 °F |
ASTM TMA |
PBI Performance Products Celazole® TF-60 C Carbon Fiber Reinforced Melt Processable Polybenzimidazole Celazole® polybenzimidazole (PBI) resin is a unique and highly stable linear hetrocyclic polymer. PBI is characterized by high strength; excellent thermal stability, and broad chemical resistance. .. |
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CTE, linear | 26.0 - 120 µm/m-°C | 14.4 - 66.7 µin/in-°F | Average value: 85.4 µm/m-°C Grade Count:71 |
Overview of materials for Polycarbonate/PET Polyester Blend This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate/PET Polyester Blend". Each property range of values reported is minimum and maximum values.. |
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CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy 141 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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Williams Advanced Alloys WS225 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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Williams Advanced Alloys WS264 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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Williams Advanced Alloys WS292 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2156 Heat Conductive Electrically Insulating Compound TRA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compon.. |
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CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Covestro Baydur® STR/C-405 IMR Polyurethane Composite SRIM Foam, 45% Glass Filled, MDI-based 2-Component Liquid System Contains continuous strand fiberglass mat.0.118 in. thickness.Information provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer .. |
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CTE, linear | 26.0 µm/m-°C | 14.4 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos.. |
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CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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AIM 80In/Pb15/Ag5 Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
CENTROPLAST CENTROMID 6 GF 30 Polyamide 6 30% glass fiber The 30% glass fibre matrix adds very high strength and rigidity to this material. It has increased dimensional accuracy when hot. Can be used for rollers, belt pulleys and racks.Information provid.. |
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CTE, linear | 26.0 µm/m-°C @Temperature 50.0 - 120 °C |
14.4 µin/in-°F @Temperature 122 - 248 °F |
IPC TM-650 2.4.24 |
Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply Low loss Ceramic-Filled Thermoset/Thermoplastic Hybrid SystemRivals PTFE laminate electrical performance in a Halogen-Free systemLight weight material relative to standard laminate materialsOptimal .. |
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CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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AIM 40In/60Pb Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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CTE, linear | 25.9 µm/m-°C | 14.4 µin/in-°F | |
Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone.. |
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CTE, linear | 26.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
14.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
Beijing Chemical Industry KAIFA® 304-G30 PBT Resin 30% glass fiber reinforced, flame retardant, low bleeding, UV-resistantInformation provided by Beijing Chemical Industry Research Institute (Group) |
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CTE, linear | 25.9 µm/m-°C | 14.4 µin/in-°F | |
Atom Adhesives AA-SUPERTHERM 05 Epoxy Adhesive AA-SUPERTHERM 05 is a thixotropic (smooth paste) Pure Diamond ultra-high thermally conductive epoxy two-part adhesive that develops strong, durable, high-impact bonds at room temperature which impro.. |
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CTE, linear | 26.0 - 34.0 µm/m-°C @Temperature 75.0 - 175 °C |
14.4 - 18.9 µin/in-°F @Temperature 167 - 347 °F |
Average value: 27.9 µm/m-°C Grade Count:1 |
Overview of materials for Polyethersulfone, Carbon Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone, Carbon Fiber Reinforced". Each property range of values reported is minimum and maximu.. |
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CTE, linear | 26.0 - 34.0 µm/m-°C @Thickness 2.00 - 4.00 mm |
14.4 - 18.9 µin/in-°F @Thickness 0.0787 - 0.157 in |
Average value: 27.9 µm/m-°C Grade Count:1 |
Overview of materials for Polyethersulfone, Carbon Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone, Carbon Fiber Reinforced". Each property range of values reported is minimum and maximu.. |
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CTE, linear | 26.0 - 55.8 µm/m-°C | 14.4 - 31.0 µin/in-°F | Average value: 35.8 µm/m-°C Grade Count:4 |
Overview of materials for Polysulfone, 20% Glass Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polysulfone, 20% Glass Fiber Reinforced". Specific grades with glass content between 15% and 24% are inc.. |
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CTE, linear | 26.0 µm/m-°C | 14.4 µin/in-°F | ISO 11359-2 |
Polyplastic Armlen® PP GF 30-1EX Polypropylene Copolymer, 30% Glass Fiber Information provided by PolyPlastic Group. |
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CTE, linear | 26.0 - 70.0 µm/m-°C | 14.4 - 38.9 µin/in-°F | Average value: 39.7 µm/m-°C Grade Count:26 |
Overview of materials for Polypropylene with 30% Glass Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Polypropylene with 30% Glass Fiber Filler". Specific grades with glass content between 25% and 34% are i.. |