Thermal Properties | Metric | English | Comments |
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CTE, linear | 57.0 µm/m-°C @Temperature 20.0 °C |
31.7 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Gharda Chemicals Gafone™ 3100 Polyethersulfone (PES)
(discontinued **) Characteristics: Excellent Thermal Resistance - Tg 224°C Outstanding Mechanical, Electrical, Flame & Chemical Resistance Very good Hydrolytic & Sterilization Resistance Good Optical Cl.. |
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CTE, linear | 57.0 - 170 µm/m-°C @Temperature 30.0 - 300 °C |
31.7 - 94.4 µin/in-°F @Temperature 86.0 - 572 °F |
Average value: 95.7 µm/m-°C Grade Count:9 |
Overview of materials for Polytetrafluoroethylene (PTFE), Molded This property data is a summary of similar materials in the MatWeb database for the category "Polytetrafluoroethylene (PTFE), Molded". Each property range of values reported is minimum and maximum v.. |
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CTE, linear | 57.0 µm/m-°C @Temperature -30.0 - 100 °C |
31.7 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
LyondellBasell Hostacomâ„¢ CB267 Thermoplastic Polyolefin Elastomer Description: Hostacomâ„¢ CB267 medium melt flow, 1,600 MPa flexural modulus thermoplastic elastomeric olefin (TEO) resin has an excellent balance of scratch and mar resistance, rigidity and impac.. |
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CTE, linear | 57.0 µm/m-°C @Temperature 40.0 - 130 °C |
31.7 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 2311 Phenolic, Granular, Injection Molded PLENCO 02311 is a versatile general purpose organic filled phenolic molding compound offering excellent mold processability and optimized cure cycles. PLENCO 02311 is also granulated to provide impr.. |
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CTE, linear | 57.0 µm/m-°C @Temperature 40.0 - 130 °C |
31.7 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 2369 Phenolic, Granular, Injection Molded PLENCO 02369 is a general purpose, organic filled phenolic molding compound, formulated to minimize the generation of free ammonia for applications that are sensitive to such formation. PLENCO 02369.. |
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CTE, linear | 57.0 µm/m-°C | 31.7 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 377 High Temperature Epoxy Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications.Advantages & Application Notes:.. |
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CTE, linear | 57.0 µm/m-°C | 31.7 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding... |
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CTE, linear | 57.0 µm/m-°C | 31.7 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® B9021 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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CTE, linear | 57.0 µm/m-°C | 31.7 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a.. |
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CTE, linear | 57.0 µm/m-°C | 31.7 µin/in-°F | uncured |
Atom Adhesives AA-DUCT 2979 Epoxy Adhesive AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability. AA-DUCT 2979 has been shown to retain their properties through hundreds of hours o.. |
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CTE, linear | 57.0 µm/m-°C | 31.7 µin/in-°F | cured |
Atom Adhesives AA-DUCT CG2 Epoxy Adhesive AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulati.. |