- HOME
- POLYMER SEARCH
- Polymer Property : CTE, linear = 35.0 µm/m-°C
Polymer Property : CTE, linear = 35.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 100 °C |
19.4 µin/in-°F @Temperature 73.4 - 212 °F |
|
| Quadrant EPP Duratron® PAI T4301 PAI + graphite + PTFE, extruded (ISO Data) The addition of PTFE and graphite provides higher wear resistance and lower coefficient of friction compared to the unfilled grade as well as a lower tendency to stick-slip. Duratron T4301 PAI also .. |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 100 °C |
19.4 µin/in-°F @Temperature 73.4 - 212 °F |
|
| Quadrant EPP Ketron® HPV PEEK + carbon fibres + PTFE + graphite, bearing grade, extruded (ISO Data) The addition of carbon fibres, PTFE and graphite to virgin PEEK results in a Ketron PEEK “bearing grade”. Its excellent tribological properties (low friction, long wear and high pressure-velocity .. |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 100 °C |
19.4 µin/in-°F @Temperature 73.4 - 212 °F |
|
| Quadrant EPP Semitron® ESd 520HR PAI, static dissipative, extruded (ISO Data) Semitron ESd 520HR has an industry first combination of electrostatic dissipation (ESd), high strength and heat resistance. This new ESd material is ideal for making nests, sockets and contactors fo.. |
|||
| CTE, linear | 35.0 - 53.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
19.4 - 29.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics Lexan® LGN1500 PC (Asia Pacific) |
|||
| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 50/CF/10/TF/15/BK 100 Polycarbonate, with carbon fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi.. |
|||
| CTE, linear | 35.0 - 40.0 µm/m-°C | 19.4 - 22.2 µin/in-°F | |
| Master Bond EP42HT-2Med Epoxy Meets USP Class VI Requirements Description: Master Bond Polymer System EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along wit.. |
|||
| CTE, linear | 35.0 - 40.0 µm/m-°C | 19.4 - 22.2 µin/in-°F | |
| Master Bond EP42HT-2ND-2Med Heat Resistant, Medical Grade Non-Drip Epoxy Master Bond Polymer System EP42HT-2ND2MED (Black) is a room temperature curable two component epoxy adhesive and sealant featuring high temperature resistance along with outstanding chemical resista.. |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
19.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
D696 |
| Zhejiang Juner 301-G20 20% Glass Fibre Reinforced and Flammable Resistant Applications: Electrons and Electricity: TV Components, Plugs of Computers, Exhaust Fans of Computers, Plugs, Sockets, Shells of Electronics, Framework of Level Output Transformers, Pipe Pedestals, .. |
|||
| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | Below Tg |
| Tra-Con Tra-Bond 342-3.5 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-3.5 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials such .. |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
|
| Tra-Con Tra-Cast 3108 General Purpose Epoxy Casting Compound TRA-CAST 3108 is a low viscosity two-part formulation recommended for underfill and encapsulating applications where the combination of good mechanical thermal and electrical properties are required.. |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
|
| Tra-Con Tra-Duct 2919 Room Temperature Conductive, Flexible Silver Epoxy Adhesive TRA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled .. |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
|
| Loctite® 3563 Epoxy Snap Cure Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
|
| Loctite® 3564 Fast flow epoxy, moderate CTE and Tg Fast Flow Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 40.0 - 130 °C |
19.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 6500 Phenolic, Briquette, Transfer Molded PLENCO 06500 is a glass reinforced phenolic molding compound offering improved strength, dimensional stability, and excellent electrical properties. UL recognized under component file E40654. 06500 .. |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
19.4 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
| CP-Polymer-Technik Wellamid® 6000 GS 50 HWCP 50% Glass Sphere Filled Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
19.4 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
| CP-Polymer-Technik Wellamid® 6000 GV 15 HWCP 15% Glass Fiber Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
19.4 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
| CP-Polymer-Technik Wellamid® 6000 MZ 301 CP Combination Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
19.4 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
| CP-Polymer-Technik Wellamid® 6600 MRGV 25/15 HWCP 25% Mineral and 15% Glass Fiber Nylon 66, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
19.4 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
| CP-Polymer-Technik Wellamid® 6600/50 GV 15 HWCP 15% Glass Fiber Nylon 66, Impact Modified Until 0°C, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
|
| Armstrong A-12 Epoxy Adhesive, at 3:2 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati.. |
|||
| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
|
| Armstrong X-81/A Epoxy Adhesive Information provided by Ellsworth Adhesives. |
|||
| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | ASTM E831 |
| Addiplast Addinyl A2 ZV15 Nylon 66, 15% Glass Filled Glass fiber reinforced, increased thermal aging stabilityInformation provided by Addiplast. |
|||
| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | ASTM E831 |
| Addiplast Addinyl C2 V15 Nylon 66/6, 15% Glass Filled Glass fiber reinforced, high strengthInformation provided by Addiplast. |
|||
| CTE, linear | 35.0 - 55.0 µm/m-°C | 19.4 - 30.6 µin/in-°F | Average value: 43.0 µm/m-°C Grade Count:5 |
| Overview of materials for Polyphenylene Ether + Styrene-Butadiene Blend, Glass Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyphenylene Ether + Styrene-Butadiene Blend, Glass Filled". Each property range of values reported is .. |
|||
Copyright © lookpolymers.com All Rights Reserved