Thermal Properties | Metric | English | Comments |
---|---|---|---|
Decomposition Temperature | 387 °C | 729 °F | Degradation Temperature |
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron.. |
|||
Decomposition Temperature | 387 °C | 729 °F | Initial; IPC TM-650 2.3.41 |
Arlon 84N Polyimide Laminate and Prepreg 84N is a high performance ceramic-filled polyimide prepreg based on Arlon's 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper lay.. |
|||
Decomposition Temperature | 387 °C | 729 °F | Onset; IPC TM-650 2.3.41 |
Arlon 85N Polyimide Laminate and Prepreg 85N is a polyimide and laminate prepreg system for PWBs requiring resistance to high temperature, both in process and in end-use application. Bromine-free chemistry provides thermal stability for a.. |