Mechanical Properties | Metric | English | Comments |
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Tensile Modulus | 2.41 - 2.76 GPa | 350 - 400 ksi | |
Master Bond EP42HT-2Med Epoxy Meets USP Class VI Requirements Description: Master Bond Polymer System EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along wit.. |
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Tensile Modulus | 2.41 - 2.76 GPa @Temperature 23.9 °C |
350 - 400 ksi @Temperature 75.0 °F |
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Master Bond EP21LSCL-1 Two Component, Room Temperature Curing Epoxy Resin Product Description: Master Bond Polymer System EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring optical clarity as well as non-yellowing properties. This system can be used.. |
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Tensile Modulus | 2.41 - 2.76 GPa | 350 - 400 ksi | |
Master Bond EP30M4 Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP30M4 is a two component epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. EP30M4 resi.. |
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Tensile Modulus | 2.41 - 2.76 GPa | 350 - 400 ksi | |
Master Bond EP42HT-2 Epoxy Adhesive Resists Sterilization Description: Master Bond Polymer System EP42HT-2 is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material featuring high temperature resistance along with o.. |